Manufacturing Resources International, Inc.

Tim Hubbard

William R Dunn

Ware Bedell

Marcos Diaz

Chris Tran

Matt Dosch

Kevin O'Connor

Mike Brown

Ryan Demars

William Dunn

A display assembly is provided which includes a housing for an electronic display and a thermal management substructure. The thermal management substructure is located rearward of the electronic display and includes multiple components, which are secured to one another by a plurality of deposits of structural adhesive. Methods of manufacturing the thermal management substructure are also provided where structural adhesive is deposited between components of the thermal management substructure.

Display assembly using structural adhesive

Electronic display assemblies are disclosed which include a housing having an intake and an exhaust, an electronic display located within the housing, a first airflow pathway fluidly connected to an ambient environment and extending through the housing between the intake and the exhaust, a first portion of which extends proximate to a rear surface of the electronic display and a second portion of which extends rearward of, and is spaced apart from, the rear surface of the electronic display. A second airflow pathway is separated from the first airflow pathway and forms a closed, continuous pathway within the housing. At least a portion of the second airflow pathway is located rearward of the electronic display. One or more electronic assemblies for operating the electronic display assembly are located within the portion of the second airflow pathway located rearward of the electronic display.

Electronic display with cooling

An electronic display assembly includes an electronic display located within a housing. A first airflow pathway fluidly connected to an ambient environment extends through at least a portion of the housing. A second airflow pathway, separated from the first airflow pathway, forms a closed loop within the housing. Some or all electronic components for operating the electronic display assembly are located within the second airflow pathway, such as to at least partially isolate such electronics from dust or other containments in ambient air.

Display assemblies with thermal management features are provided. The display assemblies include an image assembly, a housing for the image assembly having an intake and exhaust. A first, continuous airflow pathway is located within the housing, and includes a first portion located forward of the image assembly and a second portion located rearward of the image assembly. A second airflow pathway extends within the housing between the intake and the exhaust. A heat exchanger located within the housing and rearward of the image assembly includes a first set of ducted passageways forming part of the first airflow pathway and a second set of ducted passageways forming part of the second airflow pathway. The first set of ducted passageways extend alongside, in an alternating fashion with, the second set of ducted passageways.

A method for cooling a display assembly includes forcibly circulating gas about an airflow pathway extending within a housing and extending along opposing sides of an image assembly is provided. Ambient air is ingested into the housing through an intake, passed within the housing in a manner which provides thermal interaction with the circulating gas in said airflow pathway, and exhausted from the housing through an exhaust to change a temperature of the circulating gas.

A method of increasing thermal conduction in an electronic display assembly includes securing a panel forming part of a thermal management substructure for the electronic display assembly, depositing a structural adhesive to at least one of an electronic component for operating the electronic display assembly and the panel, securing said electronic component directly to a first side of the panel by way of the adhesive, and securing the thermal management substructure within a housing of the electronic display assembly such that a second side of said panel defines, at least in part, at least a portion of an airflow pathway of the electronic display assembly of which the thermal management substructure forms a part.

A display assembly includes a housing which at least partially encloses an image assembly. A cover positioned forward of, and spaced apart from, the image assembly forms at least a portion of a forward surface of the housing and permits viewing of images displayed at the image assembly therethrough. A fan assembly moves air through an airflow pathway within the housing which includes a front channel between the cover and the image assembly and a rear chamber behind the image assembly. One or more solar energy reduction layers are associated with the cover and prevent at least some ambient sunlight striking the cover from traveling therebeyond.

A method for cooling a display assembly includes forcibly circulating gas about an airflow pathway extending within a housing and surrounding an image assembly. Forcibly ingesting ambient air into the housing through an intake, passing the ingested ambient air within the housing in a manner which provides thermal interaction with the circulating gas in said airflow pathway, and exhausting the ingested ambient air from the housing through an exhaust to cool the circulating gas.

An apparatus for cooling an electronic image assembly with ambient gas and circulating gas is disclosed. A first fan may be positioned to force the circulating gas around the electronic image assembly in a closed loop while a second fan may be positioned to cause a flow of ambient gas. A structure is preferably positioned to allow the circulating gas to cross the flow of the ambient gas while substantially prohibiting the circulating gas from mixing with the ambient gas. A pair of manifolds may be placed along the sides of the electronic image assembly and may be in gaseous communication with a plurality of channels placed behind the electronic image assembly. A heat exchanger may be used in some exemplary embodiments.

System for cooling an electronic image assembly with circulating gas and ambient gas

Systems and methods for cooling an electronic image assembly are provided. A transparent panel forms a front portion of a housing for the electronic image assembly. The transparent panel is located forward of, and at least some distance from the electronic image assembly. An airflow pathway passes through the housing between said electronic image assembly and said transparent panel. An air circulation device forces air through the airflow pathway. At least one polarizer located at the transparent panel is configured to reduce solar energy entering said airflow pathway.

An electronic image assembly cooling system includes an enclosure having an electronic image assembly mounting space located therein. A closed loop gas circulation path and an open loop air flow path are provided to effectuate cooling. A common heat exchanger is located in gaseous communication with both the closed loop gas circulation path and the open loop air flow path. The closed loop gas circulation path encircles the electronic image assembly mounting space within the enclosure, while the open loop ambient air flow path facilitates removal of heat from gas circulating within the closed loop gas circulation path. A second open loop air flow path may pass through the enclosure and through a gap located rearward of the electronic image assembly mounting space to assist with heat removal when an electronic image assembly is mounted in the enclosure.

Exemplary embodiments disclosed herein provide a back pan cooling assembly for an electronic display having a rear pan. A cooling back pan is preferably positioned behind the rear pan, the space between the cooling back pan and the rear pan defining a gap. A fan is positioned to cause a flow of ambient air through the gap. An electronic component for driving the electronic display may be placed in conductive thermal communication with the cooling back pan. A rear cover can be placed against the cooling back pan to define a sealed compartment which does not permit ambient air to enter. A port can be provided within the rear cover which allows ambient air to travel between the surroundings, the fan, and the gap.

Back pan cooling assembly for electronic display

The exemplary embodiments herein provide a system for cooling an electronic display where a plate is positioned behind the electronic display, the space between the plate and the electronic display defining a first channel. A first fan is preferably positioned to force a first flow of external air through the first channel. A heat exchanger is preferably positioned adjacent to the plate where the space between the heat exchanger and the plate defines a second channel; and a second fan is preferably positioned to force a second flow of external air through the second channel and through the heat exchanger. A continuous heat sink may be placed within the first channel. Pass through gaskets may be used to ensure the external air may cross paths with the circulating gas without permitted the external air and circulating gas to mix.

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Alpharetta, GA, United States of America

Tim Hubbard