Intel Corporation

Tim Gates

Brent S Stone

Shahrokh Shahidzadeh

Jonathan P Douglas

William J Kirby

James Steven Fintel

Tim Abels

In one embodiment, the present invention includes a method for determining if a system is compatible with an up-binning or down-binning to a hardware resource of the system through RFID tag communication, receiving instructions from a remote server to upgrade the hardware resource if the system is compatible, and programming the hardware resource based on the instructions. In one such embodiment, the hardware resource may be programmed by use of programmable fuses to enable circuitry of the hardware resource. Other embodiments are described and claimed.

Radio-frequency reconfigurations of microelectronic systems in commercial packages

A fabrication method and semiconductor package provide enhanced performance. The semiconductor package includes a semiconductor die having an integrated circuit (IC), and a substrate having a die side coupled to the IC. A plurality of multi-signal bus bars is coupled to a socket side of the substrate such that the bus bars enable I/O signals to be transported between the substrate and a socket.

Semiconductor package having multi-signal bus bars

Growing community of inventors

Hillsboro, OR, United States of America

Tim Gates