Sandisk 3d LLC

Tim Chen

Peter Rabkin

George Samachisa

Tianhong Yan

Tz-Yi Liu

Perumal Ratnam

Ming-Che Wu

A non-volatile storage device comprises: a substrate; a monolithic three dimensional array of memory cells; word lines connected to the memory cells; global bit lines; vertical bit lines connected to the memory cells; and a plurality of double gated vertically oriented select devices. The double gated vertically oriented select devices are connected to the vertical bit lines and the global bit lines so that when the double gated vertically oriented select devices are activated the vertical bit lines are in communication with the global bit lines. Each double gated vertically oriented select device has two gates that are offset from each other with respect to distance to the substrate. Both gates for the double gated vertically oriented select device need be in an 'on' condition for the double gated vertically oriented select devices to be activated.

Shared-gate vertical-TFT for vertical bit line array

A vertically oriented thin film transistor (TFT) having a tunnel barrier is disclosed. The tunnel barrier may be formed from a dielectric such as silicon oxide or hafnium oxide. The vertically oriented TFT selection device with tunnel barrier may serve as a selection device in a 3D memory array. The vertically oriented TFT may be used to connect/disconnect a global bit line to/from a vertical bit line in a 3D memory array. The vertically oriented TFT may be used to connect/disconnect a source line to/from a channel of a vertical NAND string in a 3D memory array. A vertical TFT with tunnel barrier has a high breakdown voltage, low leakage current, and high on current. The tunnel barrier can be at the top junction or bottom junction of the TFT.

Vertical TFT with tunnel barrier

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Milpitas, CA, United States of America

Tim Chen