Diodes Inc.

Tim C Chen

Pin-Hao Huang

Yeng-Liang Lin

Bau Shun Huang

A rectifier package is provided, which comprises a first rectifier die having an anode and a cathode conductively bonded to a first conductive film on a first surface. The rectifier package also comprises a second rectifier die having an anode and a cathode conductively bonded to the first conductive film on a second surface, which is opposite to the first surface. The first conductive film is in contact with both anodes or both cathodes of the first rectifier die and the second rectifier die.

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Plano, TX, United States of America

Tim C Chen