Robert Boschgmbh

Tim Behrens

Denis Gugel

Thomas Kaden

Paeivi Lehtonen

Thomas Suenner

An electronic assembly includes a leadframe (), a semiconductor component (), and an electrically conductive connecting element () made of a composite material (). The connecting element () has a solderable metallization () on the composite material () on a surface that is directed towards the semiconductor component (). A thermal conductivity of the composite material () of the connecting element () is greater than a thermal conductivity of the semiconductor component () and less than a thermal conductivity of the leadframe (). The connecting element () is provided only locally in the region of the semiconductor component ().

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Tuebingen, Germany

Tim Behrens