Rogers Germany Gmbh

Tilo Welker

Karsten Schmidt

Stefan Britting

Andreas Meyer

Fabian Wagle

The invention relates to a process for producing a metal-ceramic substrate (), comprising:

Process for producing a metal-ceramic substrate, and a metal-ceramic substrate produced using such method

A solder material () for bonding a metal layer () to a ceramic layer (), in particular for forming a metal-ceramic substrate as a carrier for electrical components, comprising:

Solder material, method for producing a solder material of this type and use of a solder material of this type in order to connect a metal layer to a ceramic layer

A support substrate (), in particular a metal-ceramic substrate, as a support for electric components, comprising: —at least one metal layer () and—an insulating element (), in particular a ceramic element, a glass element, a glass ceramic element, and/or a high temperature-resistant plastic element. The at least one metal layer () and the insulating element () extend along a main extension plane (HSE) and are arranged one over the other in a stacking direction (S) running perpendicularly to the main extension plane (HSE), wherein in a completed support substrate (), a binding layer () is formed between the at least one metal layer () and the insulating element (), and an adhesive layer () of the binding layer () has a surface resistance which is greater than 5 Ohm/sq.

Support substrate and method for producing a support substrate

An electronics module (), especially a power electronics module, comprising

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Neuhaus, Germany

Tilo Welker