Osram Oled Gmbh

Tilman Rügheimer

Hubert Halbritter

Thomas Schwarz

Alexander F Pfeuffer

Lutz Höppel

Andreas Plößl

Surface-emitting semiconductor laser chip () comprising a carrier (), a layer stack () arranged on the carrier () and having a layer plane (L) extending perpendicularly to the stacking direction (R), a front side contact () and a rear side contact (), in which in operation a predetermined distribution of a current density (I) is achieved by means of current constriction in the layer stack (), wherein in the carrier () an electrical through-connection () is provided, which extends from a bottom surface () of the carrier () facing away from the layer stack () to a surface of the carrier () facing the layer stack (), and the distribution of the current density (I) is significantly influenced by the shape and size of the cross-section of the through-connection () parallel to the layer plane (L) on the surface facing the layer stack.

Surface-emitting semiconductor laser chip

In an embodiment an arrangement includes a plurality of pixels, wherein each pixel includes at least two subpixels of each color, wherein each color is defined by a predefined target color location, wherein each subpixel comprises an optoelectronic component defined by a color location, wherein the color locations of the optoelectronic components of each color is chosen such that during operation of the optoelectronic components the predefined target color location is met for each color, wherein the optoelectronic components for each color are of identical design, and a controller configured to commonly control the optoelectronic components of a color.

Arrangement for a display and method

A component assembly includes an intermediate carrier, a plurality of components and a plurality of anchoring elements. The components have at least two electrical devices and an insulating layer. At least one of the electrical devices is an optoelectronic semiconductor chip. The insulating layer is between the electrical devices of a same component. The at least two electrical devices of the same component are arranged next to one another and enclosed laterally by the insulating layer. The at least two electrical devices and the insulating layer of the same component are integral parts of a self-supporting and mechanically stable unit. The self-supporting and mechanically stable unit and the anchoring elements fix the positions of the components on the intermediate carrier. The components that are self-supporting and mechanically stable units are detachable from the intermediate carrier, and the anchoring elements release the components under mechanical load when the latter are removed.

Growing community of inventors

Wuppertal, Germany

Tilman Rügheimer