Osram Opto Semiconductors Gmbh

Osram Oled Gmbh

Osram Opto Semiconductor Gmbh

Tilman Eckert

Ee Lian Lee

Stefan Brandl

Alexander Linkov

Martin Haushalter

Frank Möllmer

Markus Arzberger

Thomas Höfer

Ralph Bertram

Kok Eng Ng

Claus Jäger

Michael Schwind

Michael Hirmer

Mario Wiengarten

Jia Ping Jackson Kua

Anuarul Ikhwan Mat Nazri

An optoelectronic component may have a semiconductor chip designed to emit electromagnetic radiation. The semiconductor chip may have a radiation exit surface, and a protective layer arranged over the radiation exit surface. The protective layer may include at least one first layer comprising an aluminum oxide and at least one second layer comprising a silicon oxide a silicon oxide, and at least one third layer comprising a titanium oxide. A current spreading layer may include one or more transparent conductive oxides arranged between the radiation exit surface and the protective layer.

Optoelectronic component

An LED filament is disclosed. In an embodiment an LED filament includes a carrier composed of a material transparent to electromagnetic radiation, two electrical terminals located on the carrier and at least two radiation-emitting semiconductor chips arranged on the carrier, wherein the semiconductor chips are electrically connected to the electrical terminals, wherein undersides of the semiconductor chips are connected by way of an adhesive layer to the carrier, wherein the adhesive layers comprise a first conversion material, wherein the first conversion material is configured to shift at least a portion of a wavelength of radiation from the semiconductor chips, wherein the semiconductor chips comprise a conversion layer on upper sides and on lateral areas, wherein the conversion layers are configured to shift at least a portion of the wavelength of the radiation from the semiconductor chips, wherein a transparent matrix material mixed with a second conversion material covers the semiconductor chips, and wherein sedimented conversion layers with an increased concentration of the second conversion material cover the upper sides and lateral areas of the semiconductor chips.

LED filament

A filament for a filament lamp includes a plurality of light emitting semiconductor chips, wherein the light emitting semiconductor chips are located on a carrier board, the light emitting semiconductor chips are electrically connected, and the carrier board is a flexible carrier board.

LED-filament and illuminant with LED-filament

An embodiment optoelectronic semiconductor device includes a housing having a leadframe with a first and second connection conductor. The housing further has a housing body surrounding the leadframe in one or more regions. The housing body extends in a vertical direction between a mounting side of the housing body and a front side of the housing body opposite the mounting side. The first connection conductor has a recess. A semiconductor chip configured to generate radiation is arranged within the housing, and the semiconductor chip is disposed in the recess and is affixed to the first connection conductor within the recess. A side face of the recess forms a reflector for reflecting the generated radiation. The first connection conductor protrudes from the housing body at the mounting side. The semiconductor chip is, in at least some regions, free of an encapsulation material adjoining the semiconductor chip.

Optoelectronic light-emitting component and leadframe assemblage

In an embodiment the optical component includes an optoelectronic semiconductor chip including a radiation emission face, a deflection element configured to deflect electromagnetic radiation emitted by the optoelectronic semiconductor chip in a main emission direction which forms an angle deviating from 90&#xb0; with the radiation emission face, wherein the deflection element is configured as a prism structure and an optical lens having an optical axis, wherein the optical axis forms an angle deviating from 90&#xb0; with the radiation emission face.

Optoelectronic component with optical elements for beam shaping and beam deflection

A carrier for an electrical component, including a substrate having a surface, with an electrically conductive contact zone arranged on the surface of the substrate, a solder pad disposed on the contact zone, and a solder stop structure disposed laterally next to the solder pad. The solder stop structure has a surface that is less wettable with liquid solder than a surface of the contact zone. The solder stop structure subdivides the contact zone into a first zone region and a second zone region, with the first zone region having the solder pad. The solder stop structure extends over a portion of a total length of the contact zone such that the contact zone has a free connecting region that is free of the solder stop structure. The first and second zone regions are connected to one another by means of the free connecting region.

Carrier for an electrical component

An optoelectronic semiconductor element may include at least one LED chip which emits infrared radiation via a top side during operation. The radiation has a global intensity maximum at wavelengths between 800 nm and 1100 nm. The radiation has, at most 5% of the intensity of the intensity maximum at a limit wavelength of 750 nm. The radiation has a visible red light component. The semiconductor element may further include a filter element, which is arranged directly or indirectly on the top side of the LED chip and which has a transmissivity of at most 5% for the visible red light component of the LED chip, wherein the transmissivity of the filter element is at least 80%, at least in part, for wavelengths between the limit wavelength and 1100 nm, and a radiation exit surface provided for emitting the filtered radiation.

Optoelectronic semiconductor element, optoelectronic semiconductor device and method for producing a plurality of optoelectronic semiconductor elements

A laser component assembly includes a carrier including first and second component portions wherein each component portion has a chip mounting surface, a lens mounting surface and a stop surface, the stop surface of each component portion includes first and second stop partial surfaces, the first stop partial surface is formed on a first stop element and the second stop partial surface is formed on a second stop element, the chip mounting surface is arranged between the first stop element and the second stop element, the stop surface is oriented perpendicularly to the chip mounting surface, a laser chip arranged on the chip mounting surface, the laser component assembly as a lens bar comprising an optical lens component portion and the lens bar is arranged on the lens mounting surfaces of the component portions and bears against the stop surfaces of the component portions.

Laser component assembly and method of producing a laser component

A laser component includes a carrier having a lens carrier surface and a chip carrier surface raised relative to the lens carrier surface, wherein an optical lens is arranged on the lens carrier surface, a laser chip is arranged on the chip carrier surface, the chip carrier surface and the lens carrier surface are formed by materially uniformly continuous sections of the carrier, the carrier includes a plastic material, and the laser component is configured as a surface-mountable SMD component.

Laser component and method for the production thereof

A laser component includes a housing and a laser chip arranged in the housing, wherein the housing includes a first soldering contact and a second soldering contact at a first outer surface, and a third soldering contact and a fourth soldering contact at a second outer surface, the first soldering contact connects to the third soldering contact in an electrically conductive manner and the second soldering contact connects to the fourth soldering contact in an electrically conductive manner, the housing includes a carrier substrate and a cover, a bottom side of the laser chip is arranged on the carrier substrate, the cover includes an encapsulation material, the laser chip is covered by the encapsulation material, and a beam direction of the laser chip is oriented in parallel to the bottom side of the laser chip.

Growing community of inventors

Tanjung Tokong, Malaysia

Tilman Eckert