Robert Boschgmbh

Em-motive Gmbh

Till Schade

Jochen Reinmuth

Frank Reichenbach

Mawuli Ametowobla

Werner Steinberger

Julia Amthor

Philip Kappe

Alexander Ilin

Tobias Hein

Andreas Topf

Jeihad Zeadan

Sarah Overmeier

Eike-Christian Kersten

A connection arrangement includes a first plastic component, a second plastic component, and a closed induction ring. The first plastic component has a first joining region designed as a receptacle, and at one end, the second plastic component has a second joining region introduced into the first joining region. At the joining regions, the induction ring is at least partially fused into the two plastic components such that at one contact region between a first plastic melt of the first plastic component and a second plastic melt of the second plastic melt, a material-conclusive connection is generated. In this case, the induction ring is melted into the first plastic component while forming at least one first undercut, and is melted into the second plastic component while forming at least one second undercut such that between the plastic components and the induction ring, one each form-fitting connection is created.

Connection arrangement and method for welding a first plastic component to a second plastic component

A method is provided for manufacturing a micromechanical component including a substrate and a cap connected to the substrate and together with the substrate enclosing a first cavity, a first pressure prevailing and a first gas mixture with a first chemical composition being enclosed in the first cavity. An access opening, connecting the first cavity to surroundings of the micromechanical component, is formed in the substrate or in the cap. The first pressure and/or the first chemical composition are adjusted in the first cavity. The access opening is sealed by introducing energy and heat into an absorbing part of the substrate or the cap with the aid of a laser. A recess is formed in a surface of the substrate or of the cap facing away from the first cavity in the area of the access opening for reducing local stresses occurring at a sealed access opening.

Structures for reducing and preventing stress and tensions during processing of silicon with the aid of melting by a laser

Growing community of inventors

Kempten, Germany

Till Schade