Applied Materials, Inc.

Tiffany Yu-Nung Cheung

Shou-Sung Chang

Chih Chung Chou

Ekaterina A Mikhaylichenko

Erik S Rondum

Anand N Iyer

Christopher Heung-Gyun Lee

Methods and apparatuses for dispensing polishing fluids onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP polishing method including urging a substrate against a surface of a pad of a polishing system using a carrier assembly. A fluid is dispensed onto the pad from a fluid delivery assembly at a variable flow rate and a first flow rate of the variable flow rate is pulsed at a frequency and a duty cycle. The frequency refers to a number of pulses of the fluid at the first flow rate per rotation of the pad. The term duty cycle refers to a percentage of the pad exposed to fluid per rotation of the pad. The carrier assembly is translated across a surface of the pad while rotating the carrier assembly about a rotational axis.

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Alameda, CA, United States of America

Tiffany Yu-Nung Cheung