Raytheon Company

Tiffany E Cassidy

David D Heston

Jon Mooney

Claire E Mooney

John G Heston

Mikel J White

An HPA MMIC assembly includes a MMIC device coupled to a thermal spreader. A ground plane is provided on the thermal spreader and coupled to FETs in the MMIC device. The multiple levels of metal separated by multiple dielectric layers provide low-loss broad-band microstrip circuits. The thermal spreader may include diamond, an air/wire-edm spreader or a multi-layer board (MLB) with heat sink vias and ground vias.

Heterogeneous multi-layer MMIC assembly

The present invention relates to microwave circuits, and more particularly to bypass circuits for bias connections. The bypass circuit comprises a capacitor in series with an inductor, the series combination being connected between the bias conductor and ground. This series combination provides low return loss at the operating frequency. A de-queueing circuit may be included in the bypass circuit to provide loss at other frequencies.

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Nevada, TX, United States of America

Tiffany E Cassidy