Arista Networks, Inc.

Tiffany Doria

Robert Morris Wilcox

Richard Neville Hibbs

Duong Cu Lu

Ian Christopher Fry

Arul Ramalingam

Jim Weaver

Steven Alf Hanssen

Ernest Mason Thurlow

Tiong Khai Soo

Zidong Lin

A processing unit. The processing unit includes a printed circuit board (PCB) including a lidless integrated circuit, a heatsink, and a damper system. The heatsink is coupled to the PCB and in thermal communication with the lidless integrated circuit via a thermal interface material. The damper system is compressed between the PCB and the heatsink and surrounding the lidless integrated circuit to absorb a portion of kinetic energy imparted to the lidless integrated circuit by an impact to the processing unit.

Damper system for a lidless integrated circuit

A processing unit disposed within a compute unit, where the compute unit includes a printed circuit board (PCB) that includes an integrated circuit; a first thermal management device, that includes a first vapor chamber thermally conductively coupled to a first side of the integrated circuit; and a first heatsink thermally conductively coupled to the first vapor chamber; and a second thermal management device, that includes a second vapor chamber; and a second heatsink thermally conductively coupled to the second vapor chamber, where the second thermal management device is thermally conductively coupled to the first thermal management device; where the PCB is interposed between the first thermal management device and the second thermal management device.

Systems for providing thermal management to integrated circuits

A mechanism to mitigate assembly torsion on an electronics assembly is provided. The mechanism including an electronics assembly and a first connector, mounted to the electronics assembly with a lower portion of the first connector proximal to the electronics assembly and an upper portion of the first connector distal to the electronics assembly. The mechanism includes a spring, mounted so as to press the upper portion of the first connector and preload the first connector against assembly force imparted by assembly of the first connector to a second connector. A method to mitigate assembly torsion on an electronics assembly is also provided.

Method and apparatus to mitigate assembly torsion

Growing community of inventors

Santa Clara, CA, United States of America

Tiffany Doria