Motorola Corporation

Freescale Semiconductor,inc.

Tien-Yu Tom Lee

James Vernon Hause

William Ernest Edwards

Li Li

Paul T Bennett

William H Lytle

Victor Adrian Chiriac

Guillermo L Romero

Herng-Der Chiou

Lei L Mercado

David D Putti

William R Blood, Jr

Bennett L Hileman

Benjamin C Chambers

Jay Jui Hsiang Liu

Victor A Chiriac

System and method protects power drivers () and () that are used for airbag deployment. Temperature sensors () are strategically located on the integrated circuit () to detect temperature levels in power drivers () and (). When the temperature in the power drivers () and () reaches a maximum level, an output is provided to logic block (). Current detecting circuit () provides an output when the current flowing in power driver () reaches a desired level. Timing circuit () is activated when it receives the output from current detecting circuit (). At the expiration of the time, timing circuit () provides an output to logic block (). When logic block () receives both outputs, logic block () shuts drivers () and () down. When temperature sensors () detects that the temperature in integrated circuit () has reached a minimum level, logic block () reactivates drivers () and ().

Structure and method of thermally protecting power devices for airbag deployment

An electronic component includes an organic interposer (), a semiconductor chip () mounted over the organic interposer, copper pads () under the organic interposer, a solder attachment () between certain ones of the copper pads, and solder interconnects () between certain other ones of the copper pads and located around an outer perimeter () of the solder attachment. The solder attachment is placed at locations within the electronic component that experience the greatest stress, which may include, for example, locations adjacent to at least a portion of a perimeter () of the semiconductor chip. In one embodiment, a surface area of the solder attachment is larger than a surface area of each one of the solder interconnects. In the same or another embodiment, the electronic component includes multiple solder attachments.

Electronic component and method of manufacturing same

A system and method for cooling are disclosed. The system for cooling includes an opening out of which a jet of coolant can flow, a target element, and a forcing device which causes the jet of coolant to flow out of the opening. The target element is positioned in front of the opening so that the jet of coolant, when flowing out of the opening, is directed toward the target element. The jet of coolant oscillates so that the jet of coolant sweeps across the target element and cools a variety of different locations along the target element.

System and method for cooling using an oscillatory impinging jet

A system ( ) and method are used for predicting and controlling the temperature of a semiconductor wafer ( ) during a solder reflow process by controlling the operating profile of a solder reflow furnace ( ). The emissivity of the surface of the wafer ( ) is measured using an infrared device ( ) prior to the solder reflow process. Using the measured emissivity value of the wafer ( ), the peak temperature of the wafer ( ) is predicted, and the operating profile of the solder reflow furnace ( ) is adjusted accordingly to achieve a desired temperature profile of the wafer ( ). A process for reflowing solder on a semiconductor wafer calculates a predicted peak temperature of a semiconductor wafer ( ) and controls the actual temperature of the wafer ( ) during a solder reflow process by controlling the operating profile of a solder reflow furnace ( ).

System and method to control solder reflow furnace with wafer surface characterization

A semiconductor device (30) includes a semiconductor chip (11) flip chip mounted on a substrate (21) and a thermally conductive chip mount (31) mounded on the semiconductor chip (11). The thermally conductive chip mount (31) has a cavity (34) formed therein. The semiconductor chip (11) fits in the cavity (34) and is thermally coupled to the thermally conductive chip mount (31). The thermally conductive chip mount (31) provides a thermal conduction path to dissipate heat generated in the semiconductor chip (11) through its sidewalls (15, 16, 17, 18).

Semiconductor component having a semiconductor chip mounted to a chip

A chip scale power semiconductor device (16) provides improved heat dissipation. A semiconductor die (19) is mounted in a first region of a substrate (18). The substrate is extended to a second region for disposing terminals (38) to make external connections to the semiconductor device. Conductors (34) formed on the substrate electrically couple the semiconductor die to the terminals. The substrate is extended for a predetermined distance to separate the second region from the first region for isolating the temperature of the semiconductor die from the local temperature at the terminals.

Semiconductor device package and method

A heat dissipation apparatus (51) has a lid (12) and an optimized fin arrangement (16) located in a cavity (57) of a base (11). Semiconductor chips (41, 42, 43, 44, 45, and 46) are coupled to the lid (12), and a heat conducting medium (47) is forced into the cavity (57) through a port (13) and out of the cavity (57) through a different port (14). Heat generated by the semiconductor chips (41, 42, 43, 44, 45, and 46) is thermally conducted into the fin arrangement (16) and then transferred into the heat conducting medium (47).

Heat dissipation apparatus and method

A method of growing semiconductor crystals including inserting a single crystal seed (14) of a semiconductor material into a melt (12) and pulling the seed (14) at a first rate to gradually grow an elongated, single crystal first neck (15), altering the pulling rate to a second rate, slower than the first rate, to grow a shoulder (17) on the first neck (15) with a diameter greater than the first neck (15), continuing to pull at the second rate to form a second neck (18) with a diameter equal to the diameter of the shoulder (17), and altering the pulling rate to a third rate, slower than the second rate, to grow a single crystal elongated body (20) of the semiconductor material.

Semiconductor crystal growth method

An apparatus plates metal bumps of uniform height on one surface of a semiconductor wafer (32). A plating tank (12) contains the plating solution. The plating solution is filtered (16) and pumped (14) through an inlet (22) to an anode plate (24) within plating cell (20). The anode plate has a solid center area to block direct in-line passage of the plating solution, and concentric rings of openings closer to its perimeter to pass the plating solution. The distance between the inlet and the anode plate is adjustable with supports to create a uniform flow of the plating solution to the surface of the semiconductor wafer for uniform plating of the array of metal bumps (30). The plating cell contains an adjustable sidewall extension (26) to set the proper distance between the anode plate and the semiconductor wafer.

Adjustable plating cell for uniform bump plating of semiconductor wafers

A method for predicting the optimum operating conditions for a two-phase liquid cooling environment using simulation software utilizes a data base containing properties for several liquid coolants. A coolant is selected from the data base, and a cooling scheme is designated. Physical properties related to an integrated circuit are entered, includinhg circuit surface heat flux. A coolant temperature and flow rate are selected. The operating conditions for the integrated circuit are calculated based upon the cooling scheme and test conditions, including calculating boiling incipience heat flux and critical heat flux. The circuit surface heat flux is compared to the boiling incipience heat flux and critical heat flux to determine if the test conditions provide for nucleate boiling. The calculations are repeated for additional temperatures and flow rates. Results are displayed in printed or graphic form.

Growing community of inventors

Phoenix, AZ, United States of America

Tien-Yu Tom Lee