Taiwan Semiconductor Manufacturing Comp. Ltd.

Tien-Wen Wang

In-Tsang Lin

Hsin-Hui Chou

Mu-Tsang Lin

Chih-Yu Wang

Jian-Hong Chen

Jun-Xiu Liu

Chung-Pin Chou

Sheng-Wen Huang

Yu-Yi Wu

Chon-Hwa Chu

Ie-Fun Lai

Wen-Sheng Chien

Chin-Chih Chen

Yao-Wen Wu

Kong-Hsin Teng

Jen-Hom Chen

Yu-Ting Wang

Jui-Kuo Lai

Joseph W L Fang

An apparatus for chemical mechanical polishing of a wafer includes a process chamber and a rotatable platen disposed inside the process chamber. A polishing pad is disposed on the platen and a wafer carrier is disposed on the platen. A slurry supply port is configured to supply slurry on the platen. A process controller is configured to control operation of the apparatus. A set of microphones is disposed inside the process chamber. The set of microphones is arranged to detect sound in the process chamber during operation of the apparatus and transmit an electrical signal corresponding to the detected sound. A signal processor is configured to receive the electrical signal from the set of microphones, process the electrical signal to enable detection of an event during operation of the apparatus, and in response to detecting the event, transmit a feedback signal to the process controller. The process controller is further configured to receive the feedback signal and initiate an action based on the received feedback signal.

System and method for monitoring chemical mechanical polishing

A system includes an inspection device and an image processing unit. The inspection device is configured to scan a wafer to generate an inspected image. The image processing unit is configured to receive the inspected image, and is configured to analyze the inspected image by using at least one deep learning algorithm in order to determine whether there is any defect image shown in a region of interest in the inspected image. When there is at least one defect image shown in the region of interest in the inspected image, the inspection device is further configured to magnify the region of interest in the inspected image to generate a magnified inspected image for identification of defects.

Inspection and cleaning system and method for the same

In a method of operating an apparatus for manufacturing or analyzing semiconductor wafers, sound in a process chamber of the apparatus during an operation of the apparatus is detected. An electrical signal corresponding to the detected sound is acquired by a signal processor. The acquired electrical signal is processed by the signal processor. An event during the operation of the apparatus is detected based on the processed electrical signal. The operation of the apparatus is controlled according to the detected event.

System and method for monitoring operation conditions of semiconductor manufacturing apparatus

A system and method for automatic SPC chart generation including a storage device and a data acquisition module. The storage device stores a chamber management tree, a recipe window management tree, a parameter configuration table and multiple chart profile records. The data acquisition module, which resides in a memory, acquires multiple process events and parameter values corresponding to the process events and a process parameter, selects a relevant statistical algorithm, calculates a statistical value by applying the statistical algorithm to the parameter values, creates a new chart profile record and a parameter statistics record therein if the chart profile record is absent, and stores the statistical values and measured time in the parameter statistics record.

Automatic statistical process control (SPC) chart generation apparatus and method thereof

A temperature-sensing wafer position detection system and method which uses temperature to determine whether a wafer is properly positioned on a bake plate prior to commencement of a photolithography baking process, for example. The system includes a bake plate and a temperature-sensing apparatus which engages the bake plate and measures the change in temperature (&#x394;T) of the bake plate over a specified time interval to determine whether the wafer is properly or improperly positioned on the support. In the event that the &#x394;T of the bake plate is at least as great as a given temperature change threshold value over a specified time interval, this indicates that the wafer is properly positioned for processing.

Temperature-sensing wafer position detection system and method

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Hsinchu, Taiwan

Tien-Wen Wang