TSMC Solid State Lighting Ltd.

Epistar Corporation

Wistron Neweb Corporation

Tien-Min Lin

Hsiao-Wen Lee

Chi-Xiang Tseng

Min-Sheng Wu

Cheng-Hsiung Hsu

I-Shan Chen

Sheng-Shin Guo

Hsin-Hung Chen

Cheng-Geng Jan

Wei-Yu Yeh

Chung Yu Wang

Ching-Yi Chen

Chih-Hsuan Sun

Yu-Sheng Tang

Hao-Yu Yang

Chia-Hong Lin

Chi Xiang Tseng

Shang-Yu Tsai

Hao-Wei Ku

Yi-Chieh Wang

Yi-Cheih Wang

A lamp includes a substrate having a center region and a peripheral region, a first subset of light-emitting devices disposed on the center region, and a second subset of light-emitting devices disposed on the peripheral region. A temperature difference between the center region and the peripheral region is greater than 10 degrees.

Lighting device with reduced light output degradation

An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.

Wafer level reflector for LED packaging

The present disclosure involves a method. The method includes providing a substrate having a layer disposed thereon. A plurality of light-emitting devices is attached to the layer. A gel is applied over the substrate. The gel covers the plurality of light-emitting devices. The gel is shaped into a plurality of lenses. The lenses each cover a respective one of the light-emitting devices. The light-emitting devices are separated from one another. The substrate and the layer are removed.

Method and apparatus for fabricating phosphor-coated LED dies

A lighting apparatus includes a first doped semiconductor layer, a light-emitting layer disposed over the first doped semiconductor layer, a second doped semiconductor layer disposed over the light-emitting layer, a first conductive terminal, a second conductive terminal, and a photo-conversion layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. The first conductive terminal and the second conductive terminal each are disposed below the first doped semiconductor layer. The photo-conversion layer is disposed over the second doped semiconductor layer and on side surfaces of the first and second doped semiconductor layers and the light-emitting layer. A bottommost surface of the photo-conversion layer is located closer to the second doped semiconductor layer than bottom surfaces of the first and second conductive terminals.

The present disclosure involves lighting apparatus. The lighting apparatus includes a light-emitting device. The light-emitting device includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A photo-conversion layer is coated around the light-emitting device. A lens houses the light-emitting device and the photo-conversion layer within. The lens includes a first sub-layer and a second sub-layer. The first and second sub-layers have different characteristics.

The present disclosure involves a method of packaging light-emitting diodes (LEDs). According to the method, a plurality of LEDs is provided over an adhesive tape. The adhesive tape is disposed on a substrate. In some embodiments, the substrate may be a glass substrate, a silicon substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer is coated over the plurality of LEDs. The phosphor layer is then cured. The tape and the substrate are removed after the curing of the phosphor layer. A replacement tape is then attached to the plurality of LEDs. A dicing process is then performed to the plurality of LEDs after the substrate has been removed. The removed substrate may then be reused for a future LED packaging process.

Method and apparatus for packaging phosphor-coated LEDs

A decoupling circuit for enhancing isolation of two monopole antennas is disclosed. The two monopole antennas substantially symmetrically stand on a bottom, and a gap is formed between the two monopole antennas. The decoupling circuit includes a grounding element located on the bottom and electrically connected to a ground, a connection bar substantially perpendicular to the bottom, including a first terminal electrically connected to the grounding element, a second terminal extending to the gap, a first branch extending from the second terminal of the connection bar to a first monopole antenna of the two monopole antennas, and a second branch extending from the second terminal of the connection bar to a second monopole antenna of the two monopole antennas.

Decoupling circuit and antenna device

The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs.

An antenna device is provided and includes a bottom, two monopole antennas, and a cover assembled with the bottom. A projection plane is defined perpendicular to the bottom. The two monopole antennas substantially symmetrically protrude from the bottom, and a gap is formed between the two monopole antennas. Projections of the two monopole antennas on the projection plane intersect with each other. Each of the two monopole antennas includes a first frequency receiving portion adjacent to the bottom, a second frequency receiving portion, and a connection portion located between the first frequency receiving portion and the second frequency receiving portion. A slot is formed through the connection portion to adjust a received frequency of the first or second frequency receiving portion. An accommodating space is formed between the cover and the bottom to accommodate the two monopole antennas.

Growing community of inventors

Chiayi, Taiwan

Tien-Min Lin