Cpumate Inc.

Golden Sun News Techniques Co., Ltd.

Tien-Chih Tseng

Kuo-Len Lin

Chih-Hung Cheng

Chen-Hsiang Lin

Mong-Hua Hung

Wen-Jung Liu

Ming-Chang Liu

A heat sink system and a heat sinking method having auto switching function are disclosed. The heat sink receives a control command sent by an external device. An internal heat sink device is controlled according to content of the control command to control power ON or power OFF of a thermoelectric cooler of the heat sink device or to control power ON, power OFF, or change rotation speed setting of a heat sink fan in the heat sink device. Thus, the heat sink auto switches operations of the heat sink device correspondingly according to temperature changes of the external device.

Heat sink system and heat sinking method having auto switching function

A heat sink having auto switching function, a heat sink system and a heat sinking method are disclosed. The heat sink receives a control command sent by an external device. An internal heat sink device is controlled according to content of the control command to control power ON or power OFF of a thermoelectric cooler of the heat sink device or to control power ON, power OFF, or change rotation speed setting of a heat sink fan in the heat sink device. Thus, the heat sink auto switches operations of the heat sink device correspondingly according to temperature changes of the external device.

Heat sink having auto switching function, heat sink system and heat sinking method for the same

A high thermal conductivity thermal interface material compound includes 53% by weight of polyethylene glycol, 42% by weight of silicon carbide, and 5% by weight of lithium ions. The method of fabricating the thermal interface material includes the steps of: filling the above-described compound in a container and blending them to form aggregative compound by a blender; mixing the compound by a rolling machine to disperse the aggregative compound and filling the compound to another container; blending the compound and breaking the air bubble generated thereof, and pumping the air out of the container by a vacuum pump at the same time, to fabricate the high thermal conductivity thermal interface material compound without air bubbles.

Thermal interface material compound and method of fabricating the same

Growing community of inventors

Wugu, Taiwan

Tien-Chih Tseng