Contemporary Amperex Technology Co., Ltd.

Contemporary Amperex Technology Limited

Tiefeng Wu

Shaojun Qiu

Nengwu Liao

Xiangqiang Huang

Tao Zhang

Ruchu Yu

Yuhuai Yang

Chao Guo

Zhiyong Deng

A die-cutting device includes a conveying mechanism configured to convey an electrode plate including uncoated and coated regions connected to each other, a cutting mechanism located on one side of the electrode plate in a thickness direction and configured to cut the uncoated region to form a scrap portion and a tab connected to the coated region, a first limiting member located between the electrode plate and the cutting mechanism in the thickness direction and provided with a cutting hole that allows laser light from the cutting mechanism to pass through and matches a cutting trajectory of the laser light, and a second limiting member located on a side of the electrode plate facing away from the first limiting member in the thickness direction and configured to cooperate with the first limiting member to limit the electrode plate in the thickness direction.

Die-cutting device

This application discloses a rewinding apparatus and a rewinding method. The rewinding apparatus is configured to rewind a strip. The rewinding apparatus includes a rewinding mechanism and a switching mechanism. The rewinding mechanism includes two shafts that are opposite to each other along a first direction and spaced out. The two shafts are configured to rewind the strip along different conveyance paths separately. The switching mechanism includes a moving roller. The moving roller is configured to drive the strip to switch from one shaft to another shaft so that the strip switches from one conveyance path to another conveyance path. The rewinding apparatus and rewinding method disclosed in this application achieve high space efficiency and high switching efficiency.

Rewinding apparatus and rewinding method

Disclosed is method and device for forming an electrode plate. The method includes: performing tab cutting on a substrate so that the substrate forms a body portion, an edge portion connecting to the body portion, and a plurality of tabs that connect to the body portion but are separated from the edge portion; and performing edge portion cutting on the substrate to separate the edge portion from the body portion. The electrode plate is formed in two steps. First, the tab and the edge portion are separated, so that in the process of cutting, impact of vibration of the edge portion on the tab is small, greatly reducing the risk of deformation of the tab caused by vibration of the edge portion and damage to the tab caused by being pulled by the edge portion. Second, edge portion cutting separates the edge portion from the body portion.

Method and apparatus of forming electrode plate

An electrode plate processing device is provided. The electrode plate processing device includes: an electrode plate conveying mechanism configured to convey an electrode plate; a cutting mechanism disposed opposite to the electrode plate and configured to cut the electrode plate to form a tab; and a waste adsorption mechanism disposed downstream of the cutting mechanism along a conveying direction of the electrode plate. The waste adsorption mechanism includes an active driving roller, a driven support roller, and a conveyer belt that is coupled to the active driving roller and the driven support roller in a transmission way. The conveyer belt is driven by the active driving roller to rotate and configured to provide an adsorption force to a waste edge produced during the cutting of the electrode plate so as to adsorb the waste edge.

Electrode plate processing device

The present disclosure relates to an electrode plate processing device. The electrode plate processing device includes: an electrode plate cutting mechanism having a cutting position; and an electrode plate rolling mechanism, through which an electrode plate passes. The electrode plate rolling mechanism includes a first roller and a second roller. The first roller has a vacuum adsorption zone for adsorbing a waste edge of the electrode plate. The cutting position is provided in upstream of the vacuum adsorption zone along a conveying direction of the electrode plate processing device.

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Ningde, China

Tiefeng Wu