Guangdong Oppo Mobile Telecommunications Corp., Ltd.

Tibo Hou

Guangming Yang

Mingren Chen

Sipeng Bi

Xin Wu

Xiangwu Lu

Wenyu Zhang

A housing assembly, a method for manufacturing the housing assembly, and an electronic device are provided according to the present disclosure. The housing assembly includes a housing body and a flexible film layer. The housing body has a bottom portion and at least one side wall connected with an outer edge of the bottom portion, and each of the at least one side wall and the bottom portion cooperatively define a bending angle larger than 70 degrees. The flexible film layer is disposed on a first surface of the housing body, and the flexible film layer has an elongation at break higher than or equal to 150%.

Housing assembly, method for manufacturing housing assembly, and electronic device

This application provides a method of manufacturing a case, a case and an electronic device. This method may include providing a metal case with a surface; applying a first oxidation treatment on the surface of the metal case to form a first oxidation layer; defining a first area on the surface; removing a portion of the first oxidation layer located within the first area; applying a second oxidation treatment on the surface within the first area to form a second oxidation layer, and forming a paint layer on the second oxidation layer by spraying.

Case, method of manufacturing the same and electronic device

Growing community of inventors

Dongguan, China

Tibo Hou