Xiamen Changelight Co., Ltd.

Tianzu Fang

Wei Jiang

Zhiwei Lin

Kaixuan Chen

Xiangjing Zhuo

Yang Wang

Jichu Tong

Yong Zhang

Junxian Li

Yingce Liu

Zhendong Wei

Xiangwu Wang

Xinmao Huang

Qimeng Lv

Xiaoping Li

Liang Chen

Yinqiao Zhang

A semiconductor wafer includes a substrate (), a buffer layer () deposited on the substrate (), and an epitaxial layer () above the buffer layer (). The buffer layer () includes a plurality of semiconductor material layers () and a plurality of oxygen-doped material layers (). The semiconductor material layers () and the oxygen-doped material layers () are deposited in an alternating arrangement on top of each other. Oxygen concentrations of the oxygen-doped material layers () gradually decrease along a direction from the substrate () to the epitaxial layer ().

Light-emitting diodes with buffer layers

Disclosed is a wafer or a material stack for semiconductor-based optoelectronic or electronic devices that minimizes or reduces misfit dislocation, as well as a method of manufacturing such wafer of material stack. A material stack according to the disclosed technology includes a substrate; a basis buffer layer of a first material disposed above the substrate; and a plurality of composite buffer layers disposed above the basis buffer layer sequentially along a growth direction. The growth direction is from the substrate to a last composite buffer layer of the plurality of composite buffer layers. Each composite buffer layer except the last composite buffer layer includes a first buffer sublayer of the first material, and a second buffer sublayer of a second material disposed above the first buffer sublayer. The thicknesses of the first buffer sublayers of the composite buffer layers decrease along the growth direction.

Buffer layers having composite structures

According to at least some embodiments of the present disclosure, a light-emitting diode (LED) chip includes a semiconductor material portion, a transparent conductive layer disposed above the semiconductor material portion, a current blocking layer disposed above the transparent conductive layer, one or more electrodes disposed above the current blocking layer, and a plurality of electron outflow channels that electrically interconnect at least one electrode and the semiconductor material portion across the transparent conductive layer and the current blocking layer.

Light-emitting diode chips with enhanced brightness

An HV-LED module having 3D light-emitting structure and a method for manufacturing the HV-LED module are disclosed. The HV-LED module has at least two stacked parts of substage LEDs that each have an independent light-emitting structure and are bonded in a staggered pattern, and the substage LEDs are connected in series to form the 3D light-emitting structure, thereby significantly increasing light-emitting power per unit area, downsizing a high-voltage chip module using it by nearly two times, and effectively reducing packaging costs for the HV-LED module.

HV-LED module having 3D light-emitting structure and manufacturing method thereof

Growing community of inventors

Xiamen, China

Tianzu Fang