Lenovo Enterprise Solutions (singapore) Pte. Ltd.

Tianyi Gao

An electronics chassis houses a plurality of electronic devices and a liquid cooling module that includes a cooling block for cooling at least one electronic device. Each liquid cooling module has a module supply conduit permanently fixed to the cooling block and a module return conduit permanently fixed to the cooling block to form a liquid passageway. A liquid unit is also disposed in the chassis and includes a liquid supply conduit and a liquid return conduit that are connected to the module supply conduit and the module return conduit of the liquid cooling module. In addition, a liquid-tight barrier is disposed in the electronics chassis to divide the electronics chassis into an electronics region containing the plurality of electronic devices and the liquid cooling module, and a liquid isolation region containing the liquid unit and allow of the connections between the liquid unit and the liquid cooling module.

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Greensboro, NC, United States of America

Tianyi Gao