Xerox Corporation

Tianxiao Xu

Ethan Shen

Johann Junginger

Chad Steven Smithson

Yujie Zhu

Yuije Zhu

Ethen Shen

Systems and methods for detecting item placement on a surface are provided. The system includes a pressure-sensitive conductive sheet and a resistive grid connected to the pressure-sensitive conductive sheet. The resistive grid includes an electrically non-conductive polymer. The resistive grid includes one or more lines arranged in a pattern. The lines may include parallel lines, parallel and perpendicular lines, concentric circles, arcs of expanding radius, and/or any other suitable types of lines and/or any combination thereof. The resistive grid may include one or more distinct lines and/or shapes positioned at various points along the pressure-sensitive sheet layer.

Systems and methods for improved sensing performance of pressure-sensitive conductive sheets

A system and method for coupling is described. The system includes, a printed electronic circuit having one or more conductive traces disposed on a flexible substrate The printed electronic circuit includes one or more magnetic couplers disposed on the flexible substrate. The system includes a magnetic connector having one or more magnets that each magnetically attach to a corresponding one of the one or more magnetic couplers The magnetic connector includes one or more spring-loaded pins each aligned with and electrically coupled to a corresponding one of the one or more conductive traces.

Magnetic connector system and method of using

An method for operating an object printing system printer prints electrical circuits on non-planar areas of objects and accurately places electronic components within the printed circuits. The method includes operation of a direct-to-object printer to form an electrical circuit on an object secured within the direct-to-object printer and operation of an electronic component placement system to retrieve an electronic component and install the electronic component in the electrical circuit on the object secured within the direct-to-object printer in response to a generation of a signal by the direct-to-object printer for the electronic component placement system that indicates the electronic component is to be installed in the circuit on the object secured within the direct-to-object printer.

Method for forming electrical circuits populated with electronic components on non-planar objects

An object printing system printer enables printing of electrical circuits on non-planar areas of objects and the accurate placement of electronic components within the printed circuits. The system includes a direct-to-object printer and an electronic component placement system. The direct-to-object printer is configured to form an electrical circuit on an object secured within the direct-to-object printer. The electronic component placement system is configured to retrieve an electronic component and install the electronic component in the electrical circuit on the object secured within the direct-to-object printer in response to the direct-to-object printer generating a signal for the electronic component placement system that indicates the electronic component is to be installed in the circuit on the object secured within the direct-to-object printer.

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Oakville, Canada

Tianxiao Xu