Omnivision Technologies, Inc.

Apple Inc.

Tianjia Sun

Tiejun Dai

Rui Wang

Paul Xiaopeng Wang

Chang Zhang

John Patrick Ternus

John B Morrell

Chun-Ming Tang

Eric Shyr

Aaron Wang

Dominic P McCarthy

Jingyi Liu

Alex Joseph Lehmann

Stephen E Dey

Madeleine S Cordier

Luis R Deliz Centeno

Liping Deng

Benjamin R Blachnitzky

Nicolai Philip Georg

Jian H Li

Yuhao Pan

Qingfei Chen

Jonathan C Atler

Hongcheng Sun

Lilli Ing-Marie Jonsson

Kevin Z Lo

Xin Hu

Paul N DuMontelle

Alhad A Palkar

Minhazul Islam

Joon-Sup Han

Sang E Lee

Shumin Wu

Lingchuan Li

Le Huang

Lilli Ing-Marie Johnsson

Hongchen Sun

Paul N Dumontelle

Luis Deliz Centeno

Jian Li

A system may include electronic devices that communicate wirelessly. When positioned so that a pair of devices overlap or are adjacent to one another, the devices may operate in a linked mode. During linked operations, devices may communicate wirelessly while input gathering and content displaying operations are shared among the devices. One or both of a pair of devices may have sensors. A capacitive sensor or other sensor may be used to measure the relative position between two devices when the two devices overlap each other. Content displaying operations and other linked mode operations may be performed based on the measured relative position between the two devices and other information.

Position sensors for system with overlapped displays

The present disclosure generally relates to engaging in cross device interactions. The method includes at a first device with a first display, while a second device having a second display is placed over a first region of the first display, detecting, via input devices of the first device, a first input. In response to detecting the first input and in accordance with a determination that the first input occurred while focus was directed to the second device, the method includes causing a response to the first input to be displayed on the second display. In response to detecting the first input and in accordance with a determination that the first input occurred while focus was directed to the first device, the method includes displaying, on the first display, a response to the first input without causing a response to the first input to be displayed on the second display.

Cross device interactions

A system may include finger devices. A touch sensor may be mounted in a finger device housing to gather input from an external object as the object moves along an exterior surface of the housing. The touch sensor may include capacitive sensor electrodes. Sensors such as force sensors, ultrasonic sensors, inertial measurement units, optical sensors, and other components may be used in gathering finger input from a user. Finger input from a user may be used to manipulate virtual objects in a mixed reality or virtual reality environment while a haptic output device in a finger device provides associated haptic output. A user may interact with real-world objects while computer-generated content is overlaid over some or all of the objects. Object rotations and other movements may be converted into input for a mixed reality or virtual reality system using force measurements or other sensors measurements made with the finger devices.

Computer systems with finger devices

An imaging system includes an image sensor and a row-period compensator. The image sensor includes an array of photosensitive pixels and electrical circuitry for controlling the array of photosensitive pixels and for reading accumulated electrical charge therefrom. The electrical circuitry is at least partially powered from a positive power rail and a negative power rail. The row-period compensator is for compensating for a change in current drawn by the electrical circuitry during at least part of a row-period of the image sensor, and the row-period compensator is electrically coupled between the positive and negative power rails. A method for compensating for a change in current drawn by electrical circuitry of an image sensor includes controlling a magnitude of compensation current drawn by a row-period compensator, to compensate for a change in current drawn by the electrical circuitry of the image sensor.

Imaging systems including row-period compensators and associated methods

Techniques and mechanisms to mitigate fixed pattern noise in image sensor data. In an embodiment, readout circuitry includes an adaptive analog-to-digital converter (ADC) comprising a differential amplifier and a feedback path coupled across the differential amplifier, where the ADC is to receive a ramp signal, a control signal associated with a transition rate of the ramp signal, and an analog signal generated by one or more pixels. In another embodiment, the feedback path and/or one or more other circuit elements coupled to the differential amplifier are configured, based on the control signal, to provide one of multiple loop gains with the differential amplifier. The ADC provides a digital output to determine a comparison based on the ramp signal and the analog signal.

Readout circuitry to mitigate column fixed pattern noise of an image sensor

A time of flight sensor includes control circuitry and a time of flight pixel array. The control circuitry is coupled to synchronously send a sync signal. The time of flight pixel array includes a plurality of time of flight pixel cells. Each one of the time of flight pixel cells includes a photosensor and a delay circuit. The photosensor is configured to generate an image signal in response to receiving photons from a light pulse reflected from an object. The delay circuit is coupled to generate a delayed sync signal in response to the sync signal. The delay circuit includes a delay transistor. The time of flight pixel array includes a transistor gradient where a transistor gate length of the delay transistor varies so that each of the time of flight pixel cells receive their respective delayed sync signal at a same time.

Time of flight imaging with improved initiation signaling

A method of implementing dynamic ground sharing in an image sensor with pipeline architecture starts with a pixel array capturing image data. Pixel array includes pixels to generate pixel data signals, respectively. A readout circuitry acquires the image data from a row in the pixel array. An analog-to-digital conversion (ADC) circuitry included in the readout circuitry samples the image data from the row to obtain sampled input data. When the ADC circuitry is sampling, a ground sharing switch is closed to couple the pixel array and the ADC circuitry to a common ground. When the ADC circuitry is not sampling, the ground sharing switch is open to separate the pixel array and the ADC circuitry from the common ground. The ADC circuitry converts the sampled image data from analog to digital to obtain an ADC output. Other embodiments are described.

Method and system for implementing dynamic ground sharing in an image sensor with pipeline architecture

A programmable current source for use with a time of flight pixel cell includes a first transistor. A current through the first transistor is responsive to a gate-source voltage of the first transistor. A current control circuit is coupled to the first transistor and coupled to a reference current source to selectively couple a reference current of the reference current source through the first transistor during a sample operation. A sample and hold circuit is coupled to the first transistor to sample a gate-source voltage of the first transistor during the sample operation. The sample and hold circuit is coupled to hold the gate-source voltage during a hold operation after the sample operation substantially equal to the gate-source voltage during the sample operation. A hold current through the first transistor during the hold operation is substantially equal to the reference current.

Programmable current source for a time of flight 3D image sensor

A pixel array includes a plurality of visible light pixels arranged in the pixel array. Each one of the plurality of visible light pixels includes a photosensitive element arranged in a first semiconductor die to detect visible light. Each one of the plurality of visible light pixels is coupled to provide color image data to visible light readout circuitry disposed in a second semiconductor die stacked with and coupled to the first semiconductor die in a stacked chip scheme. A plurality of infrared (IR) pixels arranged in the pixel array. Each one of the plurality of IR pixels includes a single photon avalanche photodiode (SPAD) arranged in the first semiconductor die to detect IR light. Each one of the plurality of visible light pixels is coupled to provide IR image data to IR light readout circuitry disposed in the second semiconductor die.

Stacked embedded SPAD image sensor for attached 3D information

A time of flight pixel cell includes a photosensor to sense photons reflected from an object. Pixel support circuitry including charging control logic is coupled to the photosensor to detect when the photosensor senses the photons reflected from the object, and coupled to receive timing signals representative of when light pulses are emitted from a light source. A controllable current source is coupled to receive a time of flight signal form the charging control logic to provide a charge current when a light pulse emitted from the light source until the photosensor senses a respective one of the photons reflected from the object. A capacitor is coupled to receive the charge current, and a voltage on the capacitor is representative of a round trip distance to the object. A reset circuit is coupled to reset the voltage on the capacitor after being charged a plurality number of times.

Pixel-level oversampling for a time of flight 3D image sensor with dual range measurements

A pixel cell includes a latch having an input terminal and an output terminal. The latch is coupled to provide a latched output signal at the output terminal responsive to the input terminal. A first precharge circuit is coupled to precharge the input terminal of the latch to a first level during a reset of the pixel cell. A single photon avalanche photodiode (SPAD) is coupled to provide a SPAD signal to the input terminal of the latch in response to a detection of a photon incident on the SPAD.

Precharged latched pixel cell for a time of flight 3D image sensor

An image sensor read out circuit includes a first current mirror circuit in which a second current conducted through a second current path is controlled in response to a first current conducted through the first current path. The second current is conducted through an amplifier transistor of a pixel circuit. A first current source is coupled to the first current path to provide a substantially constant current component of the first current. A second current source is coupled to a power supply rail of the pixel circuit and coupled to the first current path to provide a ripple current component of the first current. The ripple current component provided by the second current source is responsive to a ripple in the power supply rail. The first current is responsive to a sum of the currents from the first and second current sources.

Feed-forward technique for power supply rejection ratio improvement of bit line

An integrated circuit chip includes CMOS integrated circuit cells arranged in a semiconductor layer, each including first and second active regions, having first and second polarities, respectively. A first power rail is routed along boundaries of the CMOS integrated circuit cells proximate to the first active regions. A second power rail is routed over second active regions. Global routing channels are routed over the second active regions such that the second power rail is disposed between the global routing channels and the first power rail. The global routing channels are coupled between the CMOS integrated circuit cells to couple the CMOS integrated circuit cells together globally in the integrated circuit chip.

Standard cell global routing channels over active regions

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Santa Clara, CA, United States of America

Tianjia Sun