Advanced Systems Automation Limited

Fci Smartag Pte. Ltd.

Identive Group, Inc.

Tiang Siong Lian

Soon Chye Lian

Koo Song Low

Geok Leong Tan

Zhen Hua He

Mingzhe Du

Weng Sang-See Toh

Weng Sang See Toh

An RFID tag () has an electrically non-conductive substrate () with a mounting surface (), an electrically conductive member (), a conductive bridge (), a dielectric strip (), and a semiconductor device (). The member () is mounted to the surface () and has an inner section (), an outer section () and a connecting section (). The section () has windings () and a free end () extending from one of the windings. The section () substantially surrounds the section () and has a winding () and a free end () that extends from a portion () of the winding () towards the section (). A segment () of the section () is disposed between the ends (). The bridge () spans from the end () to the end (). With the strip () disposed between the bridge () and the member (), capacitive sections are thereby formed along the strip ().

RFID tag for an object having metallic portions, tag coupler and method thereof

A BGA mould assembly which can facilitate high degree of control over the clamping force on BGA substrates of varying thickness. An Independent drive is provided for each of the dual in-line cavity bars which clamp the BGA substrates. The drive mechanism is a wedge press which includes a servo motor, and a linear-conversion mechanism coupled to the servo motor to convert the rotation motion of the motor to a linear movement. An input wedge is coupled to the linear-conversion mechanism such that the input wedge moves correspondingly with the linear movement of the linear conversion mechanism. An output wedge is coupled to the cavity bar and positioned such that a horizontal movement by the input wedge causes the output wedge to move downwards. A roller cage is provided at the top and bottom of the input wedge to reduce friction.

BGA mould assembly for encapsulating BGA substrates of varying thickness

A method for encapsulating semiconductor devices includes the steps of: providing a molding system and a close-loop control system which is coupled to the molding system, the close-loop control system including a computer, a programmable logic control, a servo motor controller, and at least two drivers, wherein the servo motor controller is coupled to the computer and the programmable logic control, respectively, the servo motor controller is further coupled to the drivers, and the drivers are coupled to the molding system; clamping together at least one set of top and bottom molds of the molding system, the molding system including a clamping assembly having a clamping axis, the close-loop control system being coupled to the clamping assembly; feeding a molding compound into a cavity formed by a space between at least one set of top and bottom molds, the molding system further including a transfer assembly having a transfer axis; alternating a gear switching assembly of the molding system between a high speed mode and a high torque mode along the clamping axis, the gear switching assembly being coupled to the clamping assembly; and providing feedback from the close-loop control system to the clamping assembly and transfer assembly of the molding system to minimize disproportionate drive along the clamping and transfer axes, respectively.

Method of encapsulating semiconductor devices by a direct drive

A direct drive electro-mechanical press for encapsulating semiconductor devices has at least a clamping axis and a transfer axis. The clamping axis has a planetary roller screw coupled to a tie bar platen assembly on which at least one top mold is mounted. A two-speed gearbox is further coupled to the clamping axis for switching between a high speed mode and a high torque mode along the clamping axis. The two-speed gearbox has a high speed clutch coupled to a speed reducer and a high torque clutch respectively. The transfer axis is slidably located above the clamping axis; the transfer axis has another planetary roller screw coupled to a bottom platen on which at least one bottom mold is mounted. The transfer axis transfers the molding resin from the pot into the cavities formed when the top and bottom molds are clamped together. The use of two-speed gearbox and planetary roller screw along the clamping axis and the use of planetary roller screw along the transfer axis not only reduce the number of joints or links required under prior art systems, but also permit the press to deliver superior velocities and clamping tonnage. A closed-loop control is provided to the clamping and transfer axes respectively for minimizing the disproportionate drive from the electro-mechanical press. In addition to the controllers and drives, the closed-loop control provides direct feedback on the clamping tonnage on the tie bars and transfer pressure in the mold blocks.

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Tiang Siong Lian