Texas Instruments Corporation

Tiang Hock Lim

Liang Chee Tay

An apparatus for the fabrication of a semiconductor device comprising: a mold having top and bottom halves, each with cavities for holding semiconductor chips pre-assembled on an electrically insulating interposer; one of said halves having a plurality of runners and a plurality of gates for feeding encapsulation material into said cavities; said plurality of runners comprising pairs of runners parallel to each other, having gates opposite to each other, thereby forming dual gates; each pair of runners being configured such that encapsulation material will exit from adjacent gates concurrently; and each pair of dual gates being structured such that they fill the cavity between them uniformly with encapsulation material, thereby encapsulating thin semiconductor devices.

Method of encapsulating thin semiconductor chip-scale packages

A method of encapsulating a semiconductor device comprising the steps of providing a mold having top and bottom halves each with cavities for holding semiconductor devices, and further having gates and runners for feeding encapsulation material into said cavities; lining said cavities with protective plastic films; providing a plurality of semiconductor integrated circuit chips, each having an outline; providing an electrically insulating interposer; assembling said chip and said interposer, loading said assembly into said mold and introducing into said mold a low-viscosity, high adhesion encapsulation material; at least partially curing said encapsulation material, thereby forming a flat, high-luster surface; opening said mold and removing said interposer together with said encapsulated chips from said mold; attaching an array of solder balls to the exposed surface of said interposer; and singulating said encapsulated semiconductor devices, thereby forming devices having an outline substantially the same as said outline of said chips.

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Singapore, Singapore

Tiang Hock Lim