Shenzhen China Star Optoelectronics Technology Co., Ltd.

Texas Instruments Corporation

Huawei Technologies Co., Limited

Shenzhen China Star

Tian Zhang

Yuchun Hsiao

Jian Wang

Rui Guo

Changning Wang

Yanqing Tian

Chao Ge

Qin Xu Yu

Jian Jun Kong

Yu Liu

Ya Ping Chen

She Yu Tang

Sheng Yang

Fei Xie

Sisi Xie

Kuo Jung Chen

Li Bin Man

Wen Cheng Tien

Zexin Wu

Wei Cheng

Guoxing Wu

Zhao Zhou

Xiaofeng Han

Jieyan Ma

Tire

In some embodiments, a method of forming an integrated circuit includes providing a semiconductor substrate having an electronic circuit formed on a front side, and having a first material layer located over a second side of the substrate and a second material layer located between the first material layer and the second side. At least a portion of the first material layer is removed using a first chemical etching process, thereby exposing the second material layer. At least a portion of the second material layer is removed using a second chemical etching process. A portion of the substrate is then mechanically removed from the second side.

Etching and mechanical grinding film-layers stacked on a semiconductor substrate

The present disclosure discloses a metadata recovery method and apparatus, the method includes: searching for a target node, where the target node has been damaged or index information recorded in the target node has been lost; and recovering the index information in the target node according to index information recorded in a related node, where the related node includes a parent node and a child node that are of the target node and an adjacent node belonging to a same layer as the node, and the index information includes brother index information pointing to the adjacent node belonging to the same layer as the node, parent index information pointing to the parent node of the node, and child index information pointing to the child node of the node. The present disclosure is mainly applied to a process of virtual data recovery.

Metadata recovery method and apparatus

In some embodiments, a method includes wet-etching a first film layer of a plurality of film layers stacked on a semiconductor substrate, the wet-etching of the first film layer performed using a first chemical, where the first film layer is an outermost film layer stacked on the semiconductor substrate. The method further includes wet-etching a second film layer of the plurality of film layers using a second chemical. The method also includes using a mechanical grinding wheel to grind the semiconductor substrate to reduce a thickness of the semiconductor substrate.

A chemical solution cleaning process for removing backside contamination prior to metallization involves selective chemistries of a mixture containing NHOH and HOthat may be diluted to specific concentrations depending upon the topside metal and passivation of a semiconductor wafer, which is applied after removing a topside protection material to protect the topside circuitry.

Contaminant removal in ultra-thin semiconductor device fabrication

A heat dissipation substrate comprises a substrate material and a heat conductive liquid. The substrate material comprises a plurality of holes and the heat conductive liquid is permeated into the holes. The thermal expansion coefficient of the heat conductive liquid is larger than that of the substrate material. A heat dissipation substrate manufacturing method comprises steps of mixing a sinter powder and an adhesive to form a substrate material; placing the substrate material into a furnace to perform a sintering process in order to form a plurality of holes in the substrate material; and permeating a heat conductive liquid into the holes.

Heat dissipation substrate and method for manufacturing the same

A fixing device for connecting an optical film with a back plate is disclosed. The fixing device includes a supporting portion, and a protrusive portion. The supporting portion is for connecting to a sidewall of the back plate. The protrusive portion is for passing through a through hole on an extended portion of the optical film such that the optical film is fixed on the back plate. The extended portion extrudes from a main body of the optical film. The fixing devices relate to a pure mechanical or semi-mechanical connection. Such connection structure may prevent the optical film from falling off due to environment changes. In addition, the fixing devices may be used over and over. Furthermore, the connection structure is more compact than the typical ones. The fixing devices not only satisfy the trend toward narrower sidewall of liquid crystal modules, but also prevent the optical film from being bent due to thermal expansion and contraction.

Liquid crystal module and fixing device

The present invention provides an LED light bar and a backlight module using the LED light bar. The LED light bar includes a heat dissipation strip, a PCB mounted on the heat dissipation strip, LED chips mounted on the heat dissipation strip and electrically connected to the PCB, and a thermal interface material layer arranged between the LED chips and the heat dissipation strip. The LED light bar and the backlight module using the LED light bar according to the present invention arrange LED chips to be mounted to a heat dissipation strip that is of bettered thermal conduction performance to thereby avoid the conventional process of transferring terminal energy through a PCB that is of poor heat dissipation. The art is simple and the entire heat dissipation path is shortened to achieve excellent heat dissipation performance and thus ensure the quality of backlighting.

LED light bar and backlight module using the LED light bar

Disclosed are a fixing device and a backlight module using the fixing device. The fixing device includes a positioning post, an embedded part, and at least one elastic part. The embedded part is vertically inserted in the positioning post. The at least one elastic part is disposed at one end of the positioning post. The fixing device of the present invention is capable of enhancing the structure and functions to position accurately. Furthermore, the elastic part is capable of decreasing shocks at the fixed position of the fixing device and improving the problem of stress concentration.

Fixing device and backlight module using the fixing device

A method for contacting MOS devices. First openings in a photosensitive material are formed over a substrate having a top dielectric in a first die area and a second opening over a gate stack in a second die area having the top dielectric, a hard mask, and a gate electrode. The top dielectric layer is etched to form a semiconductor contact while etching at least a portion the hard mask layer thickness over a gate contact area exposed by the second opening. An inter-layer dielectric (ILD) is deposited. A photosensitive material is patterned to generate a third opening in the photosensitive material over the semiconductor contact and a fourth opening inside the gate contact area. The ILD is etched through to reopen the semiconductor contact while etching through the ILD and residual hard mask if present to provide a gate contact to the gate electrode.

Multi-landing contact etching

A light guide plate fixing structure and a backlight module using the same, comprising a first abutting wall formed at the side edge of the light guide plate, a second abutting wall formed on the backplane, and a constant-force spring arranged between the first abutting wall and the second abutting wall; the constant-force spring has a fixing end and a support end, the fixing end being fixed on the first abutting wall, the support end forming an elastic foot that abuts against the second abutting wall, with the light guide plate being fixed with the help of the elastic force produced by bounce of the constant-force spring after being pre-compressed: when the light guide plate is expanded, it can push the spring away and be released and expanded; when the light guide plate is contracted, rebound of the spring will make the spring move with the light guide plate.

Growing community of inventors

Shenzhen, China

Tian Zhang