Gn Hearing A/s

Gn Hearing 2 A/s

Thorvaldur Oli Bodvarsson

Søren Helstrup Kvist

Kamila Piotrowska

Emil Holm Knudsen

Maja Amskov Gravad

Prasong Thongkhan

Søren Kvist

Disclosed is a system, a hearing device and a method for encapsulating one or more electronic components on a substrate. The method comprises providing a dam on the substrate, the dam is provided around the one or more electronic components, the dam comprises a dam material comprising an electrically conducting material. The method comprises providing a liquid fill encapsulation material within the dam on the substrate, the fill encapsulation material encapsulates the one or more electronic components, the fill encapsulation material is configured to solidify, the solidified fill encapsulating material comprises a first surface exposed to surroundings. The method comprises applying a cover material on the first surface of the solidified fill encapsulation material, the cover material comprising an electrically conducting material, whereby the one or more electronic components are encapsulated and electromagnetically shielded.

Encapsulation of electronic components on substrate for hearing device

The present disclosure relates in a first aspect to a head-wearable hearing instrument comprising first and second portions and a radio-frequency data communication interface configured to transmit and receive data packets at transmit and receipt time slots, respectively, through a wireless communication channel. The head-wearable hearing instrument comprises a connector assembly configured to electrically and mechanically interconnect the first portion with the second portion. The second portion comprises a sensor configured to measure a physical property and generate sensor data representative of the measured physical property. The head-wearable hearing instrument further comprises a wired data communication link extending between the first and second portions through the connector assembly for transmission of sensor data during transmit time slots. Said transmit time slots of the sensor data and at least said receipt time slots of the wireless communication channel are non-overlapping in time.

Head-wearable hearing instrument with improved co-existence of multiple communication interfaces

Disclosed is a hearing device comprising a battery module. The battery module comprises a battery for powering the hearing device; a conductor unit for providing electrical connection to the battery; a conductive adhesive arranged between the battery and the conductor unit for connecting the conductor unit to the battery to form a battery component; and a coating provided at least partly around the battery component to form the battery module.

Hearing device comprising a battery module and a method of manufacturing a battery module for a hearing device

A method comprises: providing a circuit board comprising a first surface, an opposing second surface, and a ground connection; defining a shielding zone and a non-shielding zone on the first surface, one or more shielding-zone electronic components being comprised within the shielding zone; providing a groove in the circuit board, the groove extending along at least part of the shielding zone and being in-between the shielding zone and the non-shielding zone; applying an insulating encapsulation layer to cover the shielding zone, whereby the one or more shielding-zone electronic components are encapsulated; applying an electrically conductive shielding layer on top of at least part of the encapsulation layer and to the ground connection so as to electrically couple the shielding layer to the ground connection, whereby the one or more shielding-zone electronic components are electromagnetically shielded. Further, disclosed is a circuit board, and a hearing device comprising a circuit board.

Circuit board

Audio device, electronic circuit, and related methods, in particular a method of manufacturing an electronic circuit for an audio device is disclosed, the method comprising providing a circuit board; mounting one or more electronic components including a first electronic component on the circuit board; applying a first insulation layer outside the first electronic component; and applying a first shielding layer outside the first insulation layer.

Growing community of inventors

Værløse, Denmark

Thorvaldur Oli Bodvarsson