Pac Tech Packaging Technologies G.m.b.h.

Thorsten Teutsch

Elke Zakel

Ghassem Azdasht

Siavash Hosseinpour Tabrizi

Ricardo Geelhaar

The invention concerns a method for producing a chip module having a carrier substrate and at least one chip arranged on the carrier substrate, as well as a contact conductor arrangement for connecting chip pads to contacts arranged on a contact face of the chip module, in which method the front face of the chip which is provided with the chip pads is secured to the carrier substrate and then the contact conductor arrangement is formed by structuring of a contact material layer of the carrier substrate.

Method for producing a chip module

A diode arrangement includes a diode and two electrodes. Each electrode is connected to the diode in an electrically conductive manner via a soldered connection on one of two oppositely arranged contact surfaces of the diode. The contact surfaces of the diode are formed substantially by the surfaces of a lower side and an upper side of the diode and are contacted with the contact extensions of the electrodes via the soldered connection. The contact extensions forming counter contact surfaces are substantially congruent with the contact surfaces of the diode.

Diode array and method for producing a diode array

The invention relates to a contact structure () and to a method for producing a contact structure for semiconductor substrates () or the like, in particular for terminal faces of semiconductor substrates, comprising a base contact part () arranged on a terminal face () of the semiconductor substrate and at least one connecting contact part () arranged on the base contact part, wherein the connecting contact part is formed from a connecting contact material () which has a lower melting point than a base contact material of the base contact part.

Terminal face contact structure and method of making same

The invention relates to a method for removing a plurality of raised places of contact made of a meltable metal, such as tin or indium or an alloy, such as tin-containing solder, silver-containing solder or lead-containing solder, the meltable metal being meltable above a first temperature limit, the places of contact being surface-distributed over a substrate. It is also possible to form vaulted domes on a plurality of metallic support segments which are located on one of the surfaces of a substrate. The invention aims at reducing production costs, particularly at removing a soldered layer once applied. If defective contact places occur, a plurality of the raised contact places, particularly substantially all contacts, are at least in substantial portions melted off from the substrate by contacting them with a molten metal. Between the substrate and the support segments distributed over the substrate and a surface of the molten metal an organic fluid may be present, the organic fluid being provided as a covering layer only and evaporating off the substrate surface, after the vaulted domes have been formed.

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Santa Cruz, CA, United States of America

Thorsten Teutsch