Average Co-Inventor Count = 3.03
ph-index = 26
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Infineon Technologies Ag (124 from 14,621 patents)
2. Intel Corporation (44 from 54,320 patents)
3. Intel Mobile Communications Gmbh (13 from 511 patents)
4. Infineon Technologies Austria Ag (12 from 2,064 patents)
5. Intel Deutschland Gmbh (12 from 254 patents)
6. Qimonda Ag (3 from 555 patents)
207 patents:
1. 12394697 - Method for fabricating a semiconductor device package comprising a pin in the form of a drilling screw
2. 12237305 - Integrated circuit package having wirebonded multi-die stack
3. 12176222 - Semiconductor package with metal posts from structured leadframe
4. 12158448 - Radiation source device
5. 12154886 - Semiconductor packages including electrical redistribution layers of different thicknesses and methods for manufacturing thereof
6. 12136670 - Semiconductor device having contact trenches extending from opposite sides of a semiconductor body
7. 12094842 - Semiconductor device having an antenna arranged over an active main surface of a semiconductor die
8. 11984246 - Vertical inductor for WLCSP
9. 11955415 - Semiconductor device package comprising a pin in the form of a drilling screw
10. 11862582 - Package with elevated lead and structure extending vertically from encapsulant bottom
11. 11710684 - Package with separate substrate sections
12. 11652084 - Flat lead package formation method
13. 11552048 - Semiconductor device including an electrical contact with a metal layer arranged thereon
14. 11531056 - Predictive chip-maintenance
15. 11515244 - Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture