Tesa Se

Tesa Ag

Basf Aktiengesellschaft

Teas Se

Tesa Aktiengeselschaft

Thorsten Krawinkel

Bernd Lühmann

Thilo Dollase

Andreas Junghans

Jan Ellinger

Klaus Keite-Telgenbüscher

Christian Schuh

Bernd L&uuml;hmann

Achim Franck

Christian Ring

Marc Husemann

Kai Ellringmann

Anika Petersen

Minyoung Bai

Bodo Zu Putlitz

Lesmona Scherf

Klaus Keite-Telgenbüsher

Stephan Zöllner

Peter Schuhmacher

Axel Burmeister

Judith Grünauer

Kerstin Götz

Stefan Wulf

Matthias Koop

Hans R Kricheldorf

Sarah Bamberg

Frank Hannemann

Nicolai Böhm

Andreas Westphal

Kristin Kerber

Jobst-Waldemar Klemp

Renke Bargmann

Andreas Wieck

Andreas Wahlers-Schmidlin

Daniel Schmitz-Stapela

Alexander Fischer

Franziska Czerwonatis

Anja Staiger

Daniel Klier

Tanja Altenwegner

Alexander Steen

Jochen Fiencke

Sabine Thormeier

Kerstin Franck

Jessika Gargiulo

Eugenia Seibel

Yanjie Ren

Michael Mayer

Andreas Gerken

Tanja Striberny

Marji Smith

Maren Kampers

Sevil Ece

Nela Yanjie Ren

Caroline Sperling

Marcel Lorenz

Nils Utesch

Pressure-sensitive adhesives based on acrylonitrile-butadiene rubbers having good shock-resistance combined with easy removability of the adhesives from the substrate shall be provided. This is solved by a pressure-sensitive adhesive which comprises The pressure-sensitive adhesive can be used for bonding parts in mobile electronic devices.

Pressure-sensitive adhesive based on acrylonitrile butadiene rubbers

A structural adhesive bond formed with a pressure-sensitive adhesive that comprises at least two components forming one phase each, from which an interpenetrating network with at least two phases is produced by a cross-linking build-up reaction, the first phase and second phase having at least a softening point temperature of less than 23° C. and greater than 23° C., respectively, the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.

Pressure-sensitive adhesive compound containing a cross-linked nanoparticle network, method of production and use thereof

The aim is to provide an adhesive tape that effectively protects an electronic construction from permeants, especially water, and that at the same time has good gap-filling qualities. To solve this problem an adhesive tape is proposed that has in the following order:&#x2014;a carrier layer without barrier effect at least towards water and with a WVTR of at least 1 g/(m*d) (38&#xb0; C., 90% relative humidity, 50 &#x3bc;m layer thickness); &#x2014;a layer comprising at least one getter material capable of sorbing at least water; &#x2014;a water barrier ply; and&#x2014;a layer of pressure-sensitive adhesive, where the carrier layer bears an outward-facing release layer and/or the layer of pressure-sensitive adhesive is lined with a release liner which has a release layer lying on the layer of pressure-sensitive adhesive.

Adhesive tape for encapsulating electronic constructions

Pressure-sensitive adhesive compound comprising at least two components forming one phase each, from which an IPN with at least two phases is produced by a cross-linking build-up reaction, the first phase having at least a softening point temperature of less than 23&#xb0; C., and the second phase, after the build up reaction, having a softening temperature of greater than 23&#xb0; C., the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.

The invention relates to an adhesive film strip comprising at least two, particularly three, layers, which adhesive film strip can be detached without residues and nondestructively by expansive stretching substantially in the adhesion plane, with a carrier on which a first external adhesive compound layer is present on at least one side, wherein &#x2022; the adhesive compound layer consists of adhesive compound formed on the basis of vinyl aromatic block copolymers and adhesive resins, wherein at least 75% of the resin (relative to the overall resin content) is selected with a DACP (diacetone alcohol cloud point) of greater than &#x2212;20&#xb0; C., preferably greater than 0&#xb0; C., and &#x2022; the carrier has at least one layer consisting of a polyurethane with an elongation at break of at least 100% and a restoring power of more than 50%. A nonpolar hydrocarbon resin or a polyterpene resin is particularly used as the tackifier for the adhesive compound(s).

Detachable adhesive strip

A single- or double-sidedly bonding adhesive-sheet strip having a self-adhesive composition comprising a) at least one elastomer, at least one type of polybutadiene block copolymer being used as an elastomer, b) at least one partially hydrogenated hydrocarbon resin having a softening temperature of at least 90&#xb0; C., c) at least one additional hydrocarbon resin, a terpene phenol resin and/or a colophonium resin having a softening temperature of at least 90&#xb0; C., d) an optional soft resin, and e) additional additives as applicable.

Self-adhesive compound and use thereof in an adhesive tape

A method of separating two substrates bonded with a redetachable, at least single-sidedly pressure-sensitive adhesive strip composed at least of a) a core layer which has a breaking extension of at least 300%, b) an outer carrier layer which has a breaking extension of not more than 120% and which at least sectionally is connected to the core layer such that it separates from the core layer when the latter is extensionally stretched, and c) a first adhesive layer which is applied at least sectionally to the side of the outer carrier layer that is opposite the side connected to the core layer, in which the core layer is stretched in the direction of the bond plane, starting from a region which has been made nonadhesive, until the core layer releases from at least one of the outer carrier layers so that the two substrates are separated from one another.

Pressure-sensitive adhesive strip for moisture-insensitive peelable adhesive bonds

Heat-activable adhesive tape for bonding electronic components and conductor tracks, with an adhesive composed at least of:

Heat-activable and crosslinkable adhesive tape for bonding electronic components and conductor tracks

The present invention relates to a method for encapsulating an electronic arrangement against permeants, in which a pressure-sensitive adhesive composition based on vinylaromatic block copolymers is provided, and in which the pressure-sensitive adhesive composition is applied onto and/or around the regions of the electronic arrangement which are to be encapsulated.

Method for encapsulating an electronic arrangement

The invention relates to an adhesive film comprising a layer of an adhesive compound as well as conductive particles that are added to the adhesive compound, characterized in that a portion of the conductive particles are fibrous and a portion of the particles are in the form of dendritic structures.

Three-dimensional electrically conductive adhesive film

Adhesive compound as a permeant barrier, comprising (i) block copolymers having a construction A-B-A, (A-B), (A-B)X, or (A-B-A)X, where X is the radical of the coupling reagent, n is a whole number between 2 and 10, A is a polymer made of a vinyl aromatic compound and B is a polymer block made of an alkene or diene, wherein this polymer block can also be hydrated, with the condition that at least part of the A blocks is sulfonated, optionally with two-block copolymers in the form of A-B as an admixture component, and (ii) at least one tackifier resin.

Cross-linkable adhesive compound with hard and soft blocks as a permeant barrier

Temperature-stable adhesive compound, comprising (i) block copolymers having a construction A-B-A, (A-B), (A-B)X, or (A-B-A)X, where X is the radical of a coupling reagent, n is an integer between 2 and 10, A is a polymer block of a vinylaromatic, and B is a polymer block of an alkene or diene, at least some of the A blocks being sulfonated, and optionally diblock copolymers of the form A-B, and

Temperature-stable cross-linkable adhesive compound with hard and soft blocks

Heat activable adhesive tape for bonding electronic components and conductor tracks, with an adhesive composition having at least an acid-modified or acid anhydride-modified vinylaromatic block copolymer, and epoxide compound and a metal chelate.

Heat-activable adhesive tape particularly for bonding electronic components and conductor tracks

The invention relates to a solution, in particular for pre-treating a hydrophilic surface for hydrophobization, comprising: I. at least one silane of the formula (1) where R, R, Rindependently of one another are selected from the group consisting of methyl, ethyl, 2-methoxyethyl, propyl and i-propyl, butyl, benzyl m=0 or 1, n=3 to 12, p=1 or 2, and, for p=1, Y=a functional group selected from the group consisting of (meth)alkyl, (meth)acryloxy, mercapto, ureido, &#x2014;NH&#x2014;CH2&#x2014;CH2-NRRand &#x2014;NRR(where Rand Rindependently of one another are selected from the group consisting of H, alkyl, phenyl, benzyl, cycloalkyl), or, for p=2, Y=NH; and II. at least one second silane increasing the aging stability having no more than two carbon atoms bound to the silicon in a chain. 

Solution, in particular for pretreating a hydrophilic subsurface in order to improve an adhesive bond under humid and wet conditions

A method and an adhesive bond optical components, such that a first optical component is bonded to a second optical component with the adhesive, wherein the adhesive comprises at least an acid anhydride-modified vinylaromatic block copolymer, a metal chelate, and a tackifier resin, and the adhesive has a transmittance of greater than 86% and a haze of less than 5%.

Pressure-sensitive adhesive mass

Growing community of inventors

Hamburg, Germany

Thorsten Krawinkel