Pac Tech Packaging Technologies G.m.b.h.

Thorsten Krause

Ghassem Azdasht

Matthias Fettke

Andrej Kolbasow

Svetlana Milz

A bonding head for holding a substrate to be soldered includes a laser source, a vacuum source, a main body and a holding nozzle. A laser duct extends through the main body to a laser exit. The vacuum source creates a vacuum in the laser duct. The laser source directs the laser beam through the laser duct towards the laser exit. The holding nozzle is connected to the main body. A nozzle duct extends through the holding nozzle from a nozzle entry to a nozzle exit. The nozzle entry is adjacent to the laser exit. The holding nozzle is configured to hold the substrate at the nozzle exit when the vacuum source creates the vacuum in the laser duct. The laser beam passes through the nozzle duct and is directed towards the substrate. The holding nozzle is configured to hold the substrate over a mounting face of a second substrate.

Bonding head and bonding apparatus

A method for repairing a test contact arrangement in which a test contact which is disposed on a test contact carrier by means of solder material and is incorrectly positioned is gripped at a body edge by means of a gripping tool in a gripping contact phase, an absorption surface which is realized on an outer surface of the gripping tool is treated with laser radiation during the gripping contact phase, and the gripping tool performs a movement on at least one axis when the temperature is at the softening point of the solder material, in such a manner that the incorrect position is corrected by means of the movement to bring the test contact into a desired position.

Method and device including laser heating of gripper for repairing a test contact arrangement

The invention relates to a method for placing and contacting a contact element formed in particular as a test contact of a test contact arrangement, wherein in said method, for forming a heat transfer surface, a contact head provided with a contact element holding device, with the contact element received in the contact element holding device, is placed between the contact element and a contact material deposit arranged on a contact surface of a contact carrier in the direction of a feeding axis against a contact surface of the connecting material deposit, and, for realizing an at least partial fusing of the connecting material deposit and for producing a materially bonded connection between the contact element and the connecting material deposit, thermal energy is introduced into the connecting material deposit by means of treating the contact element with thermal energy, the temperature T of the contact element being measured while the contact element is being treated and the duration of the treatment being defined as a function of a determined temperature gradient dT/dt of the temperature T of the contact element.

Method for placing and contacting a test contact

A device for the application of solder material deposits includes a conveying device for conveying solder material deposits from a reservoir at an upper housing part toward an application device at a lower housing part. The conveying device can be moved from a receiving position Pto a transfer position P, in which the solder material deposit is exposed to a pressure gas via a pressure bore formed in the upper housing part and from which the solder material deposit is transferred to an application nozzle in an application position P. The application device includes an application duct formed in the lower housing and forms a lower section of a transmission duct which serves to transmit laser radiation to the solder in the application nozzle. The application duct is inclined at an application angle &#x3b1; with respect to the rotation axis.

Device for the separate application of bonding material deposits

A device for the placing and contacting of a test contact of a test contact arrangement arranged on a contact carrier featuring a contact head having at least one transmission channel for transmitting thermal energy and transferring a vacuum. The contact head is provided with a test contact receptacle at its contact end in the area of a channel mouth, the test contact receptacle having a receiving gap formed between two parallel receiving cheeks for receiving the test contact and connected with the transmission channel. The receiving cheeks have contact surfaces at their contact ends for contacting a solder deposit arranged on the contact carrier to produce a heat conducting contact with the solder material of the solder deposit.

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Velten, Germany

Thorsten Krause