Mattson Technology, Inc

Beijing E-town Semiconductor Technology, Co., Ltd

Thorsten Hülsmann

Michael Xiaoxuan Yang

Rolf Bremensdorfer

Zsolt Nenyei

Patrick Schmid

Thomas Theiler

Johannes Keppler

Steffen Frigge

Support plates for localized heating in thermal processing systems to uniformly heat workpieces are provided. In one example implementation, localized heating is achieved by modifying a heat transmittance of a support plate such that one or more portions of the support plate proximate the areas that cause cold spots transmit more heat than the rest of the support plate. For example, the one or more portions (e.g., areas proximate to one or more support pins) of the support plate have a higher heat transmittance (e.g., a higher optical transmission) than the rest of the support plate. In another example implementation, localized heating is achieved by heating a workpiece via a coherent light source through a transmissive support structure (e.g., one or more support pins, or a ring support) in addition to heating the workpiece globally by light from heat sources.

Support plate for localized heating in thermal processing systems

Disclosed is an apparatus and a method for reducing flash in an injection mold (or) which molds a molded article between a first mold surface and a second mold surface. The apparatus includes an active material actuator (orandorand) configured to, in response to application or removal of an electrical actuation signal thereto, change dimension and urge the first mold surface relative to the second mold surface to reduce flash therebetween. The apparatus also includes a transmission structure () configured to provide in use, the electrical actuation signal to said active material actuator (orandorand) includes a set of active material actuators stacked one against the other to provide a varying sealing force to urge the first mold surface relative to the second mold surface.

Method for the thermal treatment of disk-shaped substrates

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Dornstadt, Germany

Thorsten Hülsmann