Motorola Corporation

Thor D Osborn

Henry G Hughes

Heidi L Denton

DaXue Xu

A component ( ) includes a substrate ( ), a cap wafer ( ), and a protection layer ( ) formed over a surface of the cap wafer ( ). Together, the protection layer ( ) and the cap wafer ( ) form a cap structure ( ) that is bonded to the substrate ( ) via a bonding layer ( ). An opening ( ) is formed in the cap wafer ( ) by etching the cap wafer ( ). The protection layer ( ) provides protection during etching of the cap wafer ( ) for the underlying bonding layer ( ) and devices ( ) formed in the substrate ( ).

Growing community of inventors

Everett, WA, United States of America

Thor D Osborn