Dell Products Inc.

Thoong Hung Seow

Sanjoy Kumar Saha

A system for removing heat from an electronic component associated with an information handling system is disclosed. The system may comprise a mass providing a heat sink to the electronic component and a set of extended surfaces for transferring heat from the mass. The set of extended surfaces may define a primary flow direction for a cooling fluid. A first subset of the set of extended surfaces may have a first length measured in the primary flow direction. A second subset of the set of extended surfaces may have a second length measured in the primary flow direction. Each of the first and second subsets of extended surfaces may include one or more extended surfaces. The second subset of extended surfaces may be generally proximate the hotspot of the electronic component. The second length may be less than the first length such that the flow rate of the cooling fluid through the second subset of extended surfaces is greater than a flow rate of the cooling fluid through the first subset of extended surfaces.

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Parker, TX, United States of America

Thoong Hung Seow