Freescale Semiconductor,inc.

Thoon Khin Chang

Heng Keong Yip

Chee Seng Foong

Lan Chu Tan

Hei Ming Shiu

On Lok Chau

Gor Amie Lai

A method of making a solder pad includes providing a substrate having a metal layer formed on it, and applying a photo resist to the metal layer. The photo resist is patterned. A first etching operation is performed on the metal layer to form voids in the metal layer. A second etching operation is performed on the metal layer to form the solder pad. A solder mask is formed on the substrate and a portion of the solder pad.

Method of making solder pad

A method for forming reinforced interconnects or bumps on a substrate includes first forming a support structure on the substrate. A substantially filled capsule is then formed around the support structure to form an interconnect. The interconnect can reach a height of up to 300 microns.

Method for forming reinforced interconnects on a substrate

Growing community of inventors

Kuala Lumpur, Malaysia

Thoon Khin Chang