Osram Opto Semiconductors Gmbh

Osram Oled Gmbh

Osram Opto Semiconductor Gmbh

Thomas Zeiler

Peter Brick

Moritz Engl

Alexander Linkov

Joachim Reill

Michael Binder

Markus Kirsch

Frank Singer

Herbert Brunner

Georg Bogner

Michael Zitzlsperger

Stefan Groetsch

Stefan Gruber

Harald Jaeger

Simon Bluemel

Stefan Grötsch

Jörg Erich Sorg

Reiner Windisch

Julius Muschaweck

Simon Blümel

Hans-Christoph Gallmeier

Harald Jäger

Steffen Köhler

Albert Schneider

Torsten Baade

Michael Hiegler

Mathias Weiss

Lai Sham Khong

Steffen Koehler

Stefan GRÖTSCH

Steffen KÖHLER

An optoelectronic semiconductor component comprising a connection carrier with a mounting face and an electrically insulating base member. An optoelectronic semiconductor chip is arranged on the mounting face of the connection carrier. A radiation-transmissive body having four side faces is provided. The radiation-transmissive body surrounds the semiconductor chip in such a way that the radiation-transmissive body envelops outer faces of the optoelectronic semiconductor chip not facing the connection carrier in form-fitting manner. The radiation-transmissive body comprises at least one side face which extends at least in places at an angle of between 60&#xb0; and 70&#xb0; to the mounting face. The base member has a thickness which amounts to at most 250 &#x3bc;m.

Optoelectronic semiconductor component

An optoelectronic semiconductor component is provided, having a connection carrier (), an optoelectronic semiconductor chip (), which is arranged on a mounting face () of the connection carrier (), and a radiation-transmissive body (), which surrounds the semiconductor chip (), wherein the radiation-transmissive body () contains a silicone, the radiation-transmissive body () has at least one side face () which extends at least in places at an angle &#x3b2; of &#x3c;90&#xb0; to the mounting face () and the side face () is produced by a singulation process.

An optoelectronic semiconductor module includes a chip carrier, a light emitting semiconductor chip mounted on the chip carrier and a cover element with an at least partly light transmissive cover plate, which is arranged on the side of the semiconductor chip facing away from the chip carrier, and has a frame part, wherein the frame part laterally encloses the semiconductor chip, is joined to the cover plate in a joining-layer free fashion and is joined to the chip carrier on its side remote from the cover plate.

Opto-electronic semiconductor module and method for the production thereof

The application relates to a semiconductor component, a photo-reflective sensor, and also a method for producing a housing for a photo-reflective sensor, wherein the housing lower part is monolithic and has at least two cavities into which an emitter and a detector are introduced.

Semiconductor component, reflected-light barrier and method for producing a housing therefor

An optoelectronic semiconductor component is provided, having a connection carrier (), an optoelectronic semiconductor chip (), which is arranged on a mounting face () of the connection carrier (), and a radiation-transmissive body (), which surrounds the semiconductor chip (), wherein the radiation-transmissive body () contains a silicone, the radiation-transmissive body () comprises at least one side face () which extends at least in places at an angle &#x3b2; of &#x3c;90&#xb0; to the mounting face () and the side face () is produced by a singulation process.

A carrier device for a semiconductor chip includes a bondable and/or solderable metallic carrier having a mounting region for the semiconductor chip and a soldering region. The carrier is at least partly covered with a covering material. A solder barrier is arranged between the soldering region and the mounting region at an interface between the carrier and the covering material. An electronic component and an optoelectronic component are furthermore specified.

Support device for a semiconductor chip and optoelectronic component with a carrier device and electronic component with a carrier device

A plastic housing is arranged on a carrier element and is provided with a recess in which an optoelectronic component is arranged. On the side facing away from the carrier element, the recess has an opening to the outside which can be provided with a transparent cover. One or more structures can be provided on the plastic housing in order to orient the cover and/or optical components relative to the optoelectronic component.

Optoelectronic component disposed in a recess of a housing and electrical componenet disposed in the housing

An optoelectronic semiconductor device is specified, comprising a multiplicity of radiation-emitting semiconductor chips (), arranged in a matrix-like manner, wherein the semiconductor chips () are applied on a common carrier (), at least one converter element () disposed downstream of at least one semiconductor chip () for converting electromagnetic radiation emitted by the semiconductor chip (), at least one scattering element () situated downstream of each semiconductor chip () and serving for diffusely scattering electromagnetic radiation emitted by the semiconductor chip (), wherein the scattering element () is in direct contact with the converter element ().

A lens arrangement for an LED display device includes a lens. The lens has a first lens surface and an optical axis. The optical axis penetrates the first lens surface of the lens. Furthermore, the lens arrangement includes a transparent transition body, which is firmly coupled with the lens on the first lens surface, which is more temperature-resistant than the lens and which has an optical axis that is parallel to the optical axis of the lens.

Lens arrangement and LED display device

A housing body for an optoelectronic component comprises a main surface having a first area region and a second area region. The first area region and the second area region form a step in the main surface. The first area region and the second area region adjoin one another by means of an outer edge. The second area region and the outer edge enclose the first area region.

Optoelectronic device with housing body

A headlight includes a plurality of luminescence diode emitters. At least one first group of the luminescence diode emitters is arranged in a matrix having at least two columns and at least two rows, wherein in the first group the electrical connections of a first connection type of the luminescence diode emitters of a column and the electrical connections of a second connection type of the luminescence diode emitters of a row are in each case electrically connected to one another. The electrical connections of the first connection type of different columns and the electrical connections of the second connection type of different rows of the matrix are electrically insulated from one another.

Headlight comprising a plurality of luminescence diode emitters

An optoelectronic component () is provided, having at least two connecters () for electrical contacting of the component (), a housing body (), in which the connecters () are embedded in places, a heat sink (), which is connected to at least one connecter (), wherein the housing body () is formed of a plastics material, the housing body () comprises an opening (), in which the heat sink () is freely accessible in places, at least one optoelectronic semiconductor chip () is arranged in the opening () on the heat sink (), and at least two of the connecters () each comprise a chip-end portion (), which faces the at least one optoelectronic semiconductor chip (), wherein the chip-end portions () of the at least two connecters () are arranged in a common plane.

Optoelectronic component, and method for the production of an optoelectronic component

According to at least one embodiment of the semiconductor arrangement, the latter comprises a mounting side, at least one optoelectronic semiconductor chip with mutually opposing chip top and bottom, and at least one at least partially radiation-transmissive body with a body bottom, on which the semiconductor chip is mounted such that the chip top faces the body bottom. Moreover, the semiconductor arrangement comprises at least two electrical connection points for electrical contacting of the optoelectronic semiconductor chip, wherein the connection points do not project laterally beyond the body and with their side remote from the semiconductor chip delimit the semiconductor arrangement on the mounting side thereof.

Semiconductor arrangement

A method is disclosed for the manufacture of an optoelectronic component. A substrate has a first primary face and a second primary face that lies opposite the first primary face. A semiconductor body that is capable of emitting electromagnetic radiation from a front side is attached to the first primary face of the substrate. A covering that is transparent to the radiation from the optoelectronic semiconductor body is applied to at least the front side of the semiconductor body. The covering is given the form of an optical element by using a closed cavity that is shaped with the contour of the optical element.

Method for the manufacture of an optoelectronic component and an optoelectronic component

An arrangement having at least two light-emitting semiconductor components () arranged adjacent to one another has envelopes () at least partly surrounding the at least two light-emitting semiconductor components in each case. The envelopes contain a converter substance, which partly or completely converts the wavelength range of the radiation emitted by the semiconductor components. At least one optical damping element () is arranged between the at least two light-emitting semiconductor components, which optically isolates the respective envelopes of the semiconductor components in order to reduce a coupling-in from at least one envelope () into at least one other of the envelopes (), or from at least one semiconductor component () into the envelope () of at least one of the other semiconductor components ().

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Nittendorf, Germany

Thomas Zeiler