Robert Boschgmbh

Thomas Wiesa

Ralph Schimitzek

Klaus Voigtlaender

Rolf Becker

Ulrich Trescher

Thomas Raica

Helmut Bubeck

Walter Schlagmueller

Willi Kuehn

Christian Lammers

Peter Jauernig

Andreas Meier

Rolf Litzinger

Michael Krapp

Juergen Jerg

Jan Benzler

Joachim Wolff

Volker Hochholzer

Werner Nitschke

Gert Jakob

Dieter Karr

Ulrich Goebel

Stefan Huehner

Peter Schaedler

Stefan Doehren

Martin Zywietz

Albert-Andreas Hoebel

Christian Klein

Gerhard Schellenberg

Andre Lischeck

David Tastekin

Udo Hennel

Harald Laue

Stefan Rupprecht

Juergen Rottler

Rainer Schaefer

Walter Wagenbrenner

Sebastian Goepfert

Hao Jin

Qiang Hou

Jurgen Rottler

David Cello

Zhenzhong Shi

Wolfgang Nuechter

Ralf Langerjahn

The invention relates to an electronic unit (') comprising at least one printed circuit board () which is populated with a plurality of electric and/or electronic components () on one side or on both sides and which is incorporated into at least one protective housing () made of a solidified potting compound (&#x2032;). In the process, the electronic unit overall forms a volume body () in which the solidified potting compound takes up a filling volume (). In order to minimize the filling volume, the electronic unit additionally comprises a separate insert molding part () which is arranged at least adjacently to a populated side of the at least one printed circuit board and which takes up a spatially closed displacement volume in the volume body with respect to a flowable potting compound for forming the protective housing in a solidified state (&#x2032;).

Electronic unit and method for forming an electronic unit

The present invention relates to a circuit substrate arrangement comprising a base layer () made from aluminium, a circuit layer () made from copper, a dielectric layer () arranged between the base layer () and the circuit layer (), an opening () passing through the base layer (), the circuit layer () and the dielectric layer () and an electrical contact () between the base layer () and the circuit layer (), wherein the electrical contact () comprises a rivet (), wherein a frictionally connected joint () is formed between the rivet () and the base layer () and wherein an integrally bonded joint () is formed between the rivet () and the circuit layer ().

Circuit substrate arrangement with improved electrical contact

The present invention relates to a contact arrangement (), preferably for a power electronics system, comprising a printed circuit board () with a fastening hole (), comprising a metal sleeve () which is inserted into the fastening hole (), wherein the sleeve () makes contact with, preferably is soldered to, the printed circuit board (), comprising a base () on which the sleeve () lies in order to make electrical contact, and comprising a fastening element () which protrudes through the sleeve (), wherein one end of the fastening element () is fixedly connected to the base () and a head () is formed or arranged at the other end, wherein the head () of the fastening element () lies only on the sleeve () and not on the printed circuit board (), and wherein the sleeve () projects beyond the printed circuit board () by way of a first projection () on that side which faces the base (), wherein the first projection spaces apart the printed circuit board () and the base ().

Contact arrangement, preferably for a power electronics system

The arrangement relates to a circuit board having at least one electrically insulating layer and at least one electrically conductive layer. The circuit board has at least one heat-conducting element which is embedded in the electrically insulating layer and which is of thermally conductive form. The heat-conducting element is designed to transport heat losses transversely with respect to an areal extent of the circuit board. According to the arrangement, the heat-conducting element has at least two sub-elements formed in each case by a metal body. The heat-conducting element has an electrically insulating connecting layer which is arranged between the sub-elements and which is designed to electrically insulate the sub-elements with respect to one another and connect the sub-elements to one another in thermally conductive fashion.

Circuit board with a heat-conducting element

The invention relates to a contact element for connecting to a circuit board. The circuit board has at least one substrate layer, particularly an electrically insulating substrate layer. The circuit board also has at least one electrically conductive layer. The contact element is designed for connecting to the electrically conductive layer. According to the invention, the contact element is designed to be pushed onto a circuit board edge of the circuit board. The contact element is designed to reach over the circuit board edge and has at least one cutting blade with a cutting edge, the cutting edge having a harder metal in the area of a severing section than in an adjoining contact section alongside the cutting edge. The cutting edge is designed to cut through the substrate layer with the severing section when pushed onto the circuit board edge and to contact the electrically conductive layer electrically with the contact section.

Contact element for connecting to a circuit board, contact system and method

The use of a control module having at least one housing part and a multi-layer printed circuit board as the electrical connection between the inner space of the housing and components that are situated outside of the housing part is described. The multi-layer printed circuit board is the carrier for the electrical components of an electronic circuit, and is at the same time the thermal contacting to a housing part and/or a cooling element, particularly a hydraulic plate of the transmission, for a transmission control installed in an automatic transmission.

Control module for a transmission control installed in an automatic transmission

A control unit, in particular for a motor vehicle, the control unit having a housing, which has at least one heat dissipating area in which at least one electrical and/or electronic module having at least one heat dissipating element is situated, it being provided that the heat dissipating element is heat conductively connected to the heat dissipating area via a heat conducting medium which is introduced into the interior of the housing through at least one housing opening and which has a paste-like consistency, at least when introduced. A corresponding method for manufacturing a control unit is also described.

Heat dissipation from a control unit

An electrical control unit has a printed circuit board substrate, on which an electronic circuit is situated, which circuit includes multiple electrical components which are interconnected via printed conductors of the printed circuit board substrate, as well as housing parts for covering the electrical components on the printed circuit board substrate, and at least one device plug connector part situated on the printed circuit board substrate outside the section of the printed circuit board substrate covered by the housing parts. Outside the section covered by the at least one housing part and outside the section of the printed circuit board substrate provided with the device plug connector part, at least one contact point for an additional electrical component is situated on the printed circuit board substrate.

Electric control unit having a housing part and a cooling part

An easily producible and easily installable ignition mechanism for restraint devices in a vehicle includes an ignition capsule, in which at least one ignition element and its contact pins are fixed. Into the ignition capsule a pedestal can be set, in which a carrier arrangement having circuit elements is arranged. Spring elements are present, by which contact is established between circuit elements and contact pins of the ignition element when the pedestal is set into the ignition capsule.

Ignition mechanism for a restraining device in a vehicle

A method for contacting at least one printed circuit board or at least one punched grid and at least one hybrid includes the steps of: forming contact elements in a contacting foil, positioning the contacting foil over the hybrid in such a way that the contact elements are arranged at preselected positions between the printed circuit traces of the hybrid and the printed circuit traces of the printed circuit board, and etching away at least a portion of the contacting foil, such that the contact elements are at least partially freely accessible.

Method for metallizing at least one printed circuit board or at least one pressed screen and at least one hybrid

In a method for manufacturing a composite arrangement, at least one printed circuit board substrate is joined with a support under the influence of an applied pressure exerted by a press die over a weave layer (prepreg) impregnated with resin, such that the resin in the region of an opening of the printed circuit board substrate does not flow into this opening. The applied pressure is, therefore, at least partially reduced in the region of the opening of the printed circuit board substrate.

Method for manufacturing a composite arrangement

A device, in particular for use in an electronic controller, includes a card rack and a subassembly. The device is manufactured by soldering over a large area the unpopulated back side of the subassembly to this card rack. The soldering can be performed using a reflow soldering process and can be automated, and thus suitable for mass production. The electrical connections of the subassembly are led spatially and electrically separately from the mechanical attachment of the subassembly to the card rack. The subassembly can be an additional component mounted on the card rack with a new additional function, so that the controller can be flexibly adapted to a given requirement profile in a simple manner by combining, in a flexible manner, a plurality of subassemblies with different layouts and modes of operation on the card rack.

Device for using in an electronic controller

The invention is directed to a method for controlling the idle of an internal combustion engine having an intake channel for conducting air to the engine. The method utilizes sensors for generating signals characterizing the operating state of the engine and for supplying the signals to a control apparatus. A tank-venting valve is provided through which air can be conducted into the intake channel when the tank-venting valve is open. Control quantities are computed in the control apparatus in dependence upon the signals for at least the following: the tank-venting valve, an idle adjuster device, a fuel metering device and an ignition device. The air supplied to the engine is controlled with the aid of the tank-venting valve. The invention is also directed to an arrangement for carrying out the method.

Method and arrangement for controlling the idle of an internal

Throttle apparatus for an internal combustion engine

An electrical device has a printed circuit foil carrying an electrical circuit and having a throughgoing opening, a heat conductive carrier plate located at a lower side of the foil, a heating power conductor located at an upper of the foil, and a solderable edge layer located at the upper side of the printed circuit foil under the power component having dimensions corresponding to the dimensions of the power component. The edge layer limits the throughgoing opening and the foil from inside. The throughgoing opening has a side which is measured parallel to the upper side of the foil and is greater than a corresponding size of the edge layer. The throughgoing opening is filled with a heat conductive mass.

Electrical device, in particular switching or controlling device for

Growing community of inventors

Vaihingen, Germany

Thomas Wiesa