Robert Boschgmbh

Thomas Weber

Kurt Burger

Johannes Voigt

Susanne Lucas

Stefan Grosse

Guenter Schneider

Klaus Burghoff

Astrid Gahl

Jeanne Forget-Funk

A method is proposed for vacuum-coating a substrate using a plasma-CVD method. In order to control ion bombardment during the vacuum coating, a substrate voltage, produced independently from a coating plasma, is applied to the substrate. The substrate voltage is modified during the coating. The substrate voltage is a direct voltage that is pulsed in bipolar fashion with a frequency of 0.1 kHz to 10 MHz. A wear-resistant and friction-reducing multilayer structure of alternating hard material individual layers and carbon or silicon individual layers is proposed.

Method and device for vacuum-coating a substrate

Method and device for coating at least one wiper-blade element

A device for generating a free cold plasma beam having a high-frequency plasma source and a hollow body transparent to electromagnetic radiation, which is provided with at least one gas inlet opening and at least one beam outlet opening is proposed. The high-frequency plasma source is in particular a microwave plasma source or a high-frequency plasma source and initially generates at least within the hollow body a cold gas plasma, which is conducted as a free cold plasma beam via the beam outlet opening from the hollow body and enters the work chamber. The work chamber is under vacuum. The free plasma beam remains bundled in the work chamber and can be used there for cleaning, etching, or plasma coating with a reactive gas.

Device for producing a free cold plasma jet

A method is proposed for vacuum-coating a substrate using a plasma-CVD method. In order to control ion bombardment during the vacuum coating, a substrate voltage produced independently from a coating plasma is applied to the substrate. The substrate voltage is modified during the coating. The substrate voltage is a direct voltage that is pulsed in bipolar fashion with a frequency of 0.1 kHz to 10 MHz. A wear-resistant and friction-reducing multilayer structure of alternating hard material individual layers and carbon or silicon individual layers is proposed.

Described is a method for coating surfaces using a facility having sputtering electrodes, which has at least two electrodes that are spaced apart from one another and arranged inside a process chamber, and an inlet for a process gas. The two sputtering electrodes are acted upon by a bipolarly pulsed voltage in such a way that they are alternately operated as cathodes and as anodes. In addition, the frequency of the voltage is set between 1 kHz and 1 MHz. Furthermore, and that the operating parameters are selected in such a way that in operation, the electrodes are at least partially covered by a coating material.

Growing community of inventors

Korntal-Muenchingen, Germany

Thomas Weber