Texas Instruments Corporation

Thomas W Winter

Thomas Dyer Bonifield

Asad Mahmood Haider

William Robert Morrison

Gregory D Winterton

Steven M James

Thomas K Powell, Jr

A TSV-MEMS packaging process is provided. The process includes forming TSVs in the front side of the product wafer, and attaching a first carrier to the front side of the product wafer, subsequent to forming TSVs. The process further includes thinning the back side of the product wafer to expose TSV tips, detaching the first carrier from the front side of the product wafer, and transferring the thinned wafer to a second carrier with back side adhered to the second wafer carrier. Semiconductor components are added to the front side of the product wafer, followed by forming a hermetic cavity over the added semiconductor components, and detaching the second carrier from the back side of the product wafer. Wafer level processing continues after detaching the second carrier.

Double wafer carrier process for creating integrated circuit die with through-silicon vias and micro-electro-mechanical systems protected by a hermetic cavity created at the wafer level

Device design information ( ) for a semiconductor device is used to generate theoretical probability of failure information ( ), which represents the probability that a manufacturing defect will cause an electrical failure in an actual device fabricated according to the design information. An actual wafer ( ), which contains a plurality of devices ( ) manufactured according to the design information, is inspected for actual defects ( ). The probability of failure information is then used to determine for each of several detected defects a corresponding probability value. Then, the individual probability values for the respective defects are combined in order to obtain a composite failure probability, which serves as a basis for evaluating the expected yield of operational devices from the particular wafer.

Method and apparatus for predicting device yield from a semiconductor wafer

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McKinney, TX, United States of America

Thomas W Winter