Globalfoundries Inc.

Thomas W Weeks

Edward Crandal Cooney, Iii

Gary L Milo

Dinh Dang

Brett T Cucci

David A DeMuynck

Sarah A McTaggart

Patrick S Spinney

Thomas C Lee

John C Hall

Melissa J Roma

Brian P Conchieri

Jeffrey L Thompson

Aspects of the present disclosure include a test structure that includes two or more devices. Each device includes a wire disposed within a dielectric and a first via disposed over the wire and in electrical contact with the wire. Each device includes a test pad electrically connected to the first via and a polysilicon resistor electrically connected to the wire. Each of the polysilicon resistors of the two or more devices are electrically tied together. A method for forming the interconnect structure to be used for testing is also provided.

Test structure for monitoring interface delamination

A method including forming a first metal wire in a first dielectric layer, the first metal wire including a first vertical side opposite from a second vertical side; and forming a second metal wire in a second dielectric layer above the first dielectric layer, the second metal wire including a third vertical side opposite from a fourth vertical side, where the first vertical side is laterally offset from the third vertical side by a first predetermined distance, and the second vertical side is laterally offset from the fourth vertical side by a second predetermined distance, where the first metal wire and the second metal wire are in direct contact with one another.

Metal wires of a stacked inductor

Growing community of inventors

Hyde Park, VT, United States of America

Thomas W Weeks