Cooligy, Inc.

Leland Stanford Junior University

California Institute of Technology

University of California

Other

Robert Boschgmbh

Thomas W Kenny

Kenneth E Goodson

Mark Munch

Shulin Zeng

James Gill Shook

William J Kaiser

David Corbin

Juan G Santiago

Daniel J Laser

Steven B Waltman

Alissa M Fitzgerald

Chuan-Hua Chen

Robert H Grubbs

Peng Zhou

Marshall Leedy Stoller

Hoyong Chung

James C Mikkelsen

Linan Jiang

David E Huber

Renee M Thomas

Jae-Mo Koo

Evelyn Ning-Yi Wang

Lian Zhang

Ronald S Fearing

Girish Upadhya

Mark McMaster

Kellar Autumn

James Lovette

Robert J Full

Benjamin W Chui

Daniel J Lenehan

Joseph K Reynolds

Aaron Partridge

Saroj Kumar Sahu

Bongsang Kim

Dave B Corbin

Thomas R Van Zandt

Howard K Rockstad

Erika C Vote

Judith A Podosek

Renata Melamud

Saurabh Chandorkar

Manu Agarwal

Markus Lutz

Timothy D Stowe

Mark J Bly

Daniel Rugar

Douglas E Werner

Richard E Muller

Thomas R Vanzandt

Paul D Maker

Michael S Bartsch

Matthew A Hopcroft

Matt Hopcroft

Woo-Tae Park

James Horn

Sara A Shaughnessy

Jospeh Kurth Reynolds

David Crisp

This invention related to manufactured microbubbles, as well as methods of using manufactured microbubbles, for example, in medicinal applications. The invention pertains to the physical structure and materials of the microbubbles, as well as to methods for manufacturing microbubbles, methods for targeting microbubbles for specific medicinal applications, and methods for delivering microbubbles in medical treatment.

Targeting microbubbles

A closed loop cooling system and apparatus for controlling a fluid flow rate through the closed loop cooling system, the apparatus comprising a heat exchanger coupled to at least one heat generating device for removing waste heat from the heat generating device, at least one pump for circulating the fluid, a heat rejector for receiving the fluid, at least one fan for removing waste heat from the heat rejector, at least one temperature sensor coupled to the heat generating device to measure the temperature value of the at least one heat generating device, and a controller electrically coupled to the at least one pump, the at least one fan, and the at least one temperature sensor for receiving the temperature value to selectively control the fluid flow rate and the air flow rate, based on the temperature value.

Pump and fan control concepts in a cooling system

A system for cooling a heat source includes a fluid heat exchanger, a pump, a thermoelectric device and a heat rejector. The thermoelectric device includes a cooling portion and a heating portion. The heat rejector is configured to be in thermal contact with at least a portion of the heating portion of the thermoelectric device. The pump is coupled with the fluid heat exchanger and configured to pass a fluid therethrough. The thermoelectric device is configured along with the heat exchanger in the cooling system.

Cooling systems incorporating heat exchangers and thermoelectric layers

A method of forming an adhesive force includes removing a seta from a living specimen, attaching the seta to a substrate, and applying the seta to a surface so as to establish an adhesive force between the substrate and the surface. The seta is applied to the surface with a force perpendicular to the surface. The seta is then pulled with a force parallel to the surface so as to preload the adhesive force of the seta.

Adhesive microstructure and method of forming same

Mechanical transducers such as pressure sensors, resonators or other frequency-reference devices are implemented under conditions characterized by different temperatures. According to an example embodiment of the present invention, a combination of materials is implemented for mechanical transducer applications to mitigate temperature-related changes at or near a selected turnover temperature. In one application, a material property mismatch is used to facilitate single-anchor transducer applications, such as for resonators. Another application is directed to a Silicon-Silicon dioxide combination of materials.

Composite mechanical transducers and approaches therefor

Mechanical transducers such as pressure sensors, resonators or other frequency-reference devices are implemented under conditions characterized by different temperatures. According to an example embodiment of the present invention, a combination of materials is implemented for mechanical transducer applications to mitigate temperature-related changes. In one application, a material property mismatch is used to facilitate single-anchor transducer applications, such as for resonators. Another application is directed to a Silicon-Silicon dioxide combination of materials.

A method of and apparatus for cooling heat-generating devices in a cooling system is disclosed. The apparatus includes various sensors, control schemes and thermal models, to control pump flow rates and fan flow rates to minimize power consumption, fan noise, and noise transients. The apparatus further includes at least one heat-generating device, at least one heat exchanger, and at least one heat rejector. The apparatus can also include many pumps and fans. The method includes controlling a fluid flow rate of at least one pump and an air flow rate of at least one fan, in a cooling system for cooling at least one device. The method comprises the steps of: providing at least one temperature sensor coupled to measure a temperature value of each device; receiving the temperature value from each temperature sensor; and providing a controller to selectively control the fluid flow rate and the air flow rate, based on each temperature value. The method can further include the step of filling at least a portion of a heat exchanger with a thermal capacitance medium for maintaining the temperature value of the device below a maximum allowable temperature during thermal transients, wherein the heat exchanger is thermally coupled to the device.

An electrokinetic pump for pumping a liquid includes a pumping body having a plurality of narrow, short and straight pore apertures for channeling the liquid through the body. A pair of electrodes for applying a voltage differential are formed on opposing surfaces of the pumping body at opposite ends of the pore apertures. The pumping body is formed on a support structure to maintain a mechanical integrity of the pumping body. The pump can be fabricated using conventional semiconductor processing steps. The pores are preferably formed using plasma etching. The structure is oxidized to insulate the structure and also narrow the pores. A support structure is formed by etching a substrate and removing an interface oxide layer. Electrodes are formed to apply a voltage potential across the pumping body. Another method of fabricating an electrokinetic pump includes providing etch stop alignment marks so that the etch step self-terminates.

Micro-fabricated electrokinetic pump

A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are designed to prevent cracking of their enclosures and chambers. Also described are methods of preventing cracking in a liquid cooling system. In all these cases, the system must be designed to tolerate expansion when water is frozen.

Remedies to prevent cracking in a liquid system

Apparatus and methods according to the present invention utilize micropumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These micropumps are fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These micropumps also can allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the spatial and temporal characteristics of the device temperature profiles. Novel enclosed microchannel structures are also described.

Closed-loop microchannel cooling system

Growing community of inventors

San Carlos, CA, United States of America

Thomas W Kenny