Hughes Aircraft Company

Other

Lockheed Martin Corporation

The Aerospace Corporation

Ilc Dover, Inc.

Thomas W Giants

Thomas K Dougherty

Edward J Simburger

James H Matsumoto

Alec Garcia, Iii

Paul A Gierow

Suraj Prakash Rawal

Frank R Jeffrey

Stephen Emerson Scarborough

Alan R Perry

John K H Lin

Craig H Marshall

Jonathan Robert Day

Thomas W Kerslake

A flexible inflatable hinge includes curable resin for rigidly positioning panels of solar cells about the hinge in which wrap around contacts and flex circuits are disposed for routing power from the solar cells to the power bus further used for grounding the hinge. An indium tin oxide and magnesium fluoride coating is used to prevent static discharge while being transparent to ultraviolet light that cures the embedded resin after deployment for rigidizing the inflatable hinge.

Thin film solar cell inflatable ultraviolet rigidizable deployment hinge

Multiple layers of a clear insulating material, such as clear polyimide, with horizontal metalization layers therebetween and with vertical feed through metal traces therethrough form a flexible three dimension circuit printed circuit board upon which semiconductor devices, such as thin film solar cell can be directly deposited for forming a flexible electronic module, and upon which electronic discrete component can be bonded and electrically connected. In one exemplar configuration, a flexible thin film solar cell power module has thin film solar cells deposited on one side and power converters bonded on the other for a solar array power system. The flexible printed circuit board is well suited for forming electronic systems about a curved surface such as a power sphere nanosatellite.

Integrated solar power module

Polymers of silanol-terminated aromatic imide compounds of Formula I ##STR1## where R.sub.3 and R.sub.4 are each selected from the group consisting of a C.sub.1 to C.sub.6 alkyl group, an unsubstituted aryl group and a substituted aryl group, Z is a divalent radical. A preferred copolymer in accordance with the present invention is formed by polymerizing the compound of Formula I with a silicon compound having the formula ##STR2## where R.sub.3 and R.sub.4 are as defined above, X=halogen, OH, OR, NRR, or ureido,

Aromatic polyimide silanol compounds, precursors and polymers thereof

Silanol-terminated aromatic imide compounds of Formula I ##STR1## where R.sub.3 and R.sub.4 are each selected from the group consisting of a C.sub.1 to C.sub.6 alkyl group, an unsubstituted aryl group and a substituted aryl group, Z is a divalent radical. are prepared by:

Silanol-terminated aromatic imide compounds of Formula I ##STR1## where R.sub.3 and R.sub.4 are each selected from the group consistsing of a C.sub.1 to C.sub.6 alkyl group, an unsubstituted aryl group and a substituted aryl group, Z is a divalent radical. are prepared by: (a) reacting a bromoaniline compound with a chosen silylating agent to form a compound having the formula BrC.sub.6 H.sub.5 NSi(R.sub.1).sub.3 Si(R.sub.2).sub.3, where R.sub.1 and R.sub.2 are each a C.sub.1 to C.sub.4 alkyl group

[2,2,2-Trifluoro-1-(trifluoromethyl)]ethylidene-bisbenzenethiols are new compounds useful as precursors in the manufacture of polysulfide polymers and copolymers.

[2,2,2-trihalo-1-(trihalomethyl)]ethylidene-bisbenzenethiols

Acetylene terminated s-triazine oligomers are disclosed which polymerize into stable high temperature resins. The oligomers of this invention are readily prepared from off-the-shelf starting materials, they are soluble in conventional low boiling solvents and exhibit low melting points which facilitate ease of processing.

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Santa Monica, CA, United States of America

Thomas W Giants