Raytheon Company

University of Massachusetts

Other

Chu Associates, Inc.

Thomas V Sikina

James E Benedict

Andrew R Southworth

John P Haven

Jack J Schuss

Kevin Wilder

Mikhail Pevzner

Erika Klek

Channing Paige Favreau

Mary K Herndon

Peter J Adams

Gregory M Fagerlund

Semira M Azadzoi

Jonathan E Nufio-Molina

Yueh-Chi Chang

Alkim Akyurtlu

Phillip W Thiessen

Jeffrey C Upton

Gregory G Beninati

Oshadha K Ranasingha

Michael Ryan Souliotis

Joseph E Hilliard, Jr

Patrick J Makridakis

Matthew Souza

Aaron Michael Torberg

Oscar J Bedigian

Alexander T Gilbert

Robert S Isom

Kaichiang Chang

Eli Brookner

Yuchoi Francis Lok

Peter R Drake

Fernando Beltran

Michael T Borkowski

Leon Green

John W Roman

Paul A Danello

Thomas J Tellinghuisen

Ronni J Cavener

Robert V Cummings

Joseph P Biondi

Jacqueline M Bourgeois

Steven P Kemp

Keith D Trott

Daniel F Rypysc

Donald G Hersey

Joseph C Yeh

Bradley G Porter

Leonard C Bennett

Brandon K Mui

Karen A Rapoza

William J Clark

Timothy David Deley

James M McGuinnis

Erdem A Yurteri

Carolyn R Reistad

Izabella Furman

Francis Hartwich

James M Mcguinnis

Kevin M Wilder

Erika C Klek

Described herein is an apparatus and a method for an antenna array calibration device and method. The device comprises a radio frequency/optical (RF/optical) data center having at least one optical input/output; N single mode fibers (SMF) each having a proximal end connected to the at least one optical input/output of the RF/optical data center and a distal end, where N is a positive integer; N optical/RF dish calibrators each having an optical input/output connected to the distal end of the at least one SMF input/output; N coaxial transmission lines each having a proximal end connected to one of the RF input/output of the N optical/RF dish calibrators and a distal end; and N dish antennas each connected to the distal end of one of the N coaxial transmission lines.

Antenna array calibration device and method

A dual-polarized PCB array antenna includes one or more PCBs and a radiating antenna array. Each PCB has a PCB mounting surface that extends from a first PCB end to an opposing second PCB end. The radiating antenna array includes one or more radiator substrates. Each radiator substrate has a patch mounting surface that extends from a first substrate end to an opposing second substrate end. The dual-polarized PCB array antenna further includes one or more orthogonal interfaces configured to arrange the patch mounting surface of a given radiator substrates in an orthogonal position with respect to the PCB mounting surface of a given PCB.

Orthogonal printed circuit board interface

A unit cell of an array antenna includes an integrated dilation and feed circuit and an associated radiator assembly. The integrated dilation and feed circuit includes an asymmetric dilation layer, an asymmetric combiner layer, a symmetric feed layer and a symmetric slot layer. Feed circuits on the feed layer are configured to couple radio frequency (RF) signals to/from a pair of orthogonally disposed slot elements symmetrically disposed on the slot layer of the integrated dilation-feed circuit. The slot layer couples signals to and from the radiator assembly. Such unit cell may be used to provide an array antenna including an active electronically scanned array (AESA) antenna.

Polarization versatile radiator

A compressible dielectric standoff configured to mount at least one antenna on a ground plane of an antenna assembly includes a ground plane end configured to contact the ground plane and at least one antenna end configured to contact the at least one antenna. The compressible dielectric standoff is movable between a compressed state in which the ground plane end is spaced apart from the at least one antenna end a first distance, and an expanded state in which the ground plane end is spaced apart from the at least one antenna end a second distance. The first distance is smaller than the second distance.

Collapsible dielectric standoff

A low profile array (LPA) includes an antenna element array layer having at least one Faraday wall, and a beamformer circuit layer coupled to the antenna element array layer. The beamformer circuit layer has at least one Faraday wall. The Faraday walls extends between ground planes associated with at least one of the antenna element array layer and the beamformer circuit layer.

Low profile phased array

Methods and apparatus for a housing assembly including a housing comprising a conductive material, a conductor extending through the housing, and a dielectric material at least partially surrounding the conductor. Portions of the housing may surround the conductor such that the conductor, the dielectric, and the portions of the housing form a channel through the housing.

Electromechanical assembly having integrated conductor

A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

Wall for isolation enhancement

A dual band frequency selective radiator array includes a high band radiator array disposed on a dielectric layer for transmitting and receiving high band radar signals; a low band radiator array disposed on a front side of the high band radiator array for transmitting and receiving low band radar signals; a frequency selective surface (FSS) tuned to the high band radar signals forming a surface of the low band radiator array and passes the high band radar signals to the high band radiator array; and a single aperture disposed in front of the low band radiator array, the high band radiator array and the FSS for both the low band radiator array and the high band radiator array for transmitting and receiving the radar signals.

Dual band frequency selective radiator array

The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.

Spiral antenna and related fabrication techniques

A wave phased array is manufactured using additive manufacturing technology (AMT). The wave phased array includes a radiator, a radiator dilation layer supporting the radiator, a beamformer supporting the radiator dilation layer, a beamformer dilation layer supporting the beamformer, and a substrate support layer supporting the beamformer dilation layer. At least one of the radiator, the radiator dilation layer, the beamformer, the beamformer dilation layer and the substrate support layer is fabricated at least in part by an AMT process.

Millimeter wave phased array

A method of fabricating a printed circuit assembly includes providing a flexible-hybrid circuit having a base and at least one side panel. The at least one side panel is hingedly connected to the base. The method further includes disposing a support structure on the flexible-hybrid circuit. The support structure includes a base, which is disposed on the base of the flexible-hybrid circuit, and at least one side that corresponds to the at least one side panel of the flexible-hybrid circuit. The method further includes folding the at least one side panel of the flexible-hybrid circuit so that the at least one side panel is disposed co-planar with the at least one side of the support structure to create a printed circuit assembly.

Method for manufacturing non-planar arrays with a single flex-hybrid circuit card

An antenna and method of manufacturing an antenna. The antenna includes a radiator feed layer, a first radiator patch assembly attached to the radiator feed layer, and a second radiator patch assembly attached to the radiator feed layer. The first radiator patch assembly is separated from the second radiator patch assembly by an air gap. The first radiator patch assembly is attached to the radiator feed layer and the second radiator patch assembly is attached to the radiator feed layer separated from the first radiator patch assembly by the air gap.

Segmented patch phased array radiator

A dual band dipole radiator array includes a high band radiator array disposed on a dielectric layer for transmitting and receiving high band radar signals; a low band radiator array disposed on a front side of the high band radiator array for transmitting and receiving low band radar signals; a foam material between the low band radiator array and the high band radiator array for support; and a single aperture for both the low band radiator array and the high band radiator array for transmitting and receiving the radar signals, where the low band radiator array is comprised of a plurality of dipole structures disposed within the foam material and tuned to pass through high band radar signals to or from the high band radiator array.

Dual band dipole radiator array

An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.

Method for fabricating Z-axis vertical launch

Growing community of inventors

Acton, MA, United States of America

Thomas V Sikina