Robert Boschgmbh

Thomas Ullmann

Hans-Juergen Herderich

Franz Jost

Anton Dukart

Klaus Marx

Roland Schmid

Thomas Schneider

Reinhold Jocham

Mathias Elzner

A sensor assembly comprising a holder body and a housed semiconductor sensor element situated on the holder body for rotational speed measurement and/or position measurement, a cured enveloping material that covers the housed semiconductor sensor element completely being situated on the holder body. It is provided that the housed semiconductor sensor element is glued onto a mounting surface of the holder body using an adhesive that differs from the enveloping material, and that the adhesive is situated in a receiving space between the mounting surface and a bottom side of the housed semiconductor sensor element that is facing the mounting surface.

Sensor assembly and method for producing a sensor assembly

The sensor device accurately measures small angle changes of mechanical parts that rotate relative to each other. The sensor device includes only one cylindrical magnet (,) extending axially from a first part; two magnetoresistive sensors (,) mounted on a second part and located in the magnetic field of the sole magnet (,), the two magnetoresistive sensors having respective magnetic field sensitive layers (MS) facing a magnetic pole of the magnet (,), extending tangentially to a rotation direction in which the parts rotate relative to each other and generating respective output signals according to magnetic field line direction; and a device (PT) for combining the respective output signals of the two magnetoresistive sensors (,) to produce a combined output signal characteristic of the relative rotation angle of the parts. The combined output signal is set to zero when the parts are at a predetermined relative rotation angle.

Sensor arrangement for detecting changes in angle

In a connection arrangement between a sensor and connection leads, only a small installation space is required. To this end, the connection arrangement has a signal amplifier, which is electrically contacted by means of bond connections with the sensor and the connection leads. This is achieved by means of connecting elements, which are designed as thin sheet-metal shaped parts and are fixed with tab-shaped end sections in a housing of plastic, in which the signal amplifier is also inserted. The end sections, the signal amplifier, and the bond connections are arranged in a space-saving manner in roughly one plane. The connection arrangement is especially suited for sensors used to measure the speed of motor vehicles.

Connection arrangement between a sensor and connection leads

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Arnstadt, Germany

Thomas Ullmann