Intel Corporation

Thomas T Holden

George Vergis

Zhichao Zhang

Sanka Ganesan

Xiang Li

Ram S Viswanath

Rajasekaran Swaminathan

Jeffory L Smalley

Dimitrios Ziakas

Bassam N Coury

Kuang C Liu

David J Llapitan

Gregorio R Murtagian

Chong J Zhao

Jonathan W Thibado

Mani Prakash

John M Lynch

John Barnes

Paul A Gutierrez

Merrill George

Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.

CPU package substrates with removable memory mechanical interfaces

An assembly for attaching a printed circuit board to a chassis includes a mounting rail for engagement with the printed circuit board and a guide member for engagement with the chassis. In one embodiment, the mounting rail includes an elongated body member having a first side and a second side and a spacer formed in the first side. A lock member for engaging the printed circuit board is coupled to the spacer. The guide member defines a guide slot for slidably receiving the mounting rail.

Tool-less circuit board mounting system

An apparatus comprising an enclosure, a power supply circuit and a passive heat removal device is described. Specifically, the enclosure having a plurality of sides defines an air plenum wherein select ones of the plurality of sides have openings disposed therein with a fan disposed within a first of the openings. The power supply circuit, disposed within the enclosure, is operative to provide power to electronic components disposed outside of the enclosure, and to dissipate heat into the air plenum. The passive heat removal device, disposed along a first of said plurality of sides, is operative to transfer heat generated by one or more electronic devices thermally coupled to the outside of the enclosure into the air plenum for evacuation by the fan.

Method and apparatus for the thermal management of electronic devices

Growing community of inventors

Olympia, WA, United States of America

Thomas T Holden