Rca Inc.

General Electric Company

Nippon Sheet Glass Company, Limited

Thomas T Hitch

Robert Richard Demers

Kazuo Katsuki

Edward J Conlon

John C Connolly

Ralph DeStephanis

Thomas Ernest McCurdy

A chip package for an IC chip having at least an optical-signal input or output section comprises a container-like chip carrier for carrying the IC chip, a sealing cover bonded to the chip carrier and having a window for the optical-signal section, and a connector plate holding a plurality of optical signal transmission elements which are used to transmit a plurality of optical signals en bloc so that optical signals are input to or output from the optical-signal section through the window on the cover. The chip carrier and the connector plate are securely attached to a circuit board in the state where the connector plate has been separately positioned in a predetermined spatial relationship with the chip carrier.

Chip package with microlens array

A two-stage gas distribution nozzle for a muffle furnace includes an inner pipe with spaced apertures for feeding gas at spaced intervals to an outer pipe enclosing the inner pipe. The outer pipe includes spaced apertures facing in a direction such that the jets of gas from the inner pipe impinge on a wall of the outer pipe opposite the outer pipe apertures. The gas in the outer pipe is at lower pressure than the gas in the inner pipe and is more uniformly distributed along the length of the outer pipe to provide more uniform flow to the ambient atmosphere in the muffle.

Fluid distribution apparatus

A muffle furnace burnout section includes dual parallel spargers each having parallel first and second sparger sections. The region between the first and second sparger sections includes a thermal and gas barrier transition section secured to the spargers. The transition section is removable from the muffle with the sparger assembly as an integral unit. The transition section is adjustable and mates with a transition barrier plate secured within the muffle at the transition region.

Transition section for muffle furnace

A method for leaching mercury soluble metals from mercury insoluble substrates such as microelectronic devices without damaging the substrate or contaminating the environment with mercury. A mercury vapor jet is formed by passing mercury vapors through an orifice at residual gas pressure of about 10.sup.-2 Torr and a temperature of from about 65.degree. C. to about 150.degree. C. The mercury vapor jet strikes the substrate at an angle which is substantially perpendicular to the center of the substrate and leaches the mercury soluble metal therefrom.

Mercury vapor leaching from microelectronic substrates

A microcircuit adhesion testing method and fixture for uniform placement and soldering of a preselected length of wire above a film pad on a microcircuit substrate with consistent substrate-to-wire spacing, comprising a holder for the substrate, finger spacers attached to the holder, and a member for pressing the wire against the spacers. The spacers are made of a material which is not wettable with solder of the type used to attach the wire to the film.

Wire placement fixture

A thick-film ink for forming electrically conductive areas on ceramic substrates comprising an organic vehicle and solids composed of 0.5-8% by weight cupric oxide and 99.5-92% by weight finely divided silver.

Growing community of inventors

Lawrenceville, NJ, United States of America

Thomas T Hitch