Asea Brown Boveri Inc.

Abb Management Ag

Thomas Stockmeier

Friedhelm Bauer

Jens Gobrecht

Klas Lilja

Uwe Thiemann

Kenneth Johansson

A power semiconductor component having integrated protection against electrostatic destruction is published. Such a semiconductor component (1) comprises a semiconductor substrate (10) having at least one MOS structure whose gate (7) is arranged insulated from the semiconductor substrate (10). Such structures are susceptible to destruction by a dielectric breakdown of the insulation layer, caused by electrostatic charging. According to the invention, this insulating layer between-the gate electrode (3) and the main electrode (2) is now replaced by a semi-insulating layer (9) so that a limited current flow becomes possible between the gate (7) and the main electrode (2) and it is no longer possible for any potential difference to build up.

MOS-controlled power semiconductor component

In a bidirectional semiconductor switch which can be switched on and off, printed conductors which form the main term terminals (1, 2) and the control terminals (3, 4) are applied to a baseplate (9). Applied to the printed conductors, which form the main terminals (1, 2), are at least two reverse-blocking semiconductor components (5a-h) which can be switched on and off. The control electrodes (8a, 8e) and the second main electrodes (7a, 7e) of the semiconductor components (5a-h) are interconnected in such a way that the semiconductor switch has the required bidirectional switching function.

Bidirectional semiconductor switch with hybrid construction

A turn-off power semiconductor component subdivided into unit cells (EZ), including between an anode (A) and a cathode (K) in a semiconductor substrate (1) five layers in p-n-p-n-p sequence, namely an anode layer (10) an n-type base layer (9), a p-type base layer (8), a turn-off region (6), a cathode region (7) adjoining the turn-off region, and a p-doped short-circuit region (5). On the cathode side in every unit cell (EZ), a first MOSFET (M1) which can be driven via a first insulated gate electrode (G1) is provided for the purpose of switching between the five-layer structure and a conventional thyristor four-layer structure. A second MOSFET (M2) having a second gate electrode (G2) prevents a breakdown between the p-type short-circuit region (5) and the turn-off region (6) during turn-off. p-Type short-circuit region (5), turn-off region (6) and cathode region (7) are introduced in a self-aligning manner into the semiconductor substrate (1) through the windows (F1, F2) between the gate electrodes (G 1 and G2, respectively). Current filamentation during turn-off is effectively avoided by the switchable five-layer structure. The self-aligning production makes possible a component having precise patterning.

Turn-off power semiconductor component, and also process for producing it

In a large-area controlled-turn-off high-power semiconductor component containing a multiplicity of finely structured individual components, a semiconductor device (12) is formed by a multiplicity of small-area semiconductor chips (7) which are accommodated alongside one another in a common housing (13) and connected in parallel. This achievement avoids problems of yield with structures which are becoming finer.

Controlled-turn-off high-power semiconductor component

In the case of a symmetrically constructed TRIAC, which comprises a semiconductor substrate (20) with an internal n-base layer (9), two adjoining p-base layers (7, 11), two n-emitter regions (4, 12) let into the p-base layers (7, 11), two main electrodes (1, 17) arranged on the principal faces (29, 30), and two firing devices, a simplified control is achieved by means of MOS-controlled short circuits (3, 5, 6, 7 or 11, 13, 14, 16) at the n-emitter regions (4 or 12).

Bidirectional semiconductor component that can be turned off

In an MOS-controlled bipolar power semiconductor component, a recombination layer (10), which is doped with the same polarity as the base layer but more highly, is inserted, starting with the structure of an IGBT, into the base layer between anode (A) and cathode (K), which recombination layer divides the base layer into an upper and lower base layer (7a and 7b, respectively). The resultant structure forms a series circuit of MOSFET (T) and PIN diode (D) which is free of latch-up and provides the possibility of higher blocking voltages.

Growing community of inventors

Wurenlingen, Switzerland

Thomas Stockmeier