Semikron Elektronik Gmbh &co.kg

Semikron Elektronik Gmbh

Semikron Elektronik Gmbh & Co. Kg Patentabteilung

Thomas Stockmeier

Jürgen Steger

Marco Lederer

Rainer Popp

Peter Beckedahl

Christian Göbl

Heinrich Heilbronner

Reinhard Herzer

Markus Knebel

Yvonne Manz

Karlheinz Augustin

Dirk Heidenreich

A method for making a power semiconductor module and a module produced by that method, wherein the module includes a substrate, a connection device and load terminal elements, wherein power semiconductor components are arranged on a conductor track of the substrate and connected to one of the load terminal element by the connection device. The power semiconductor module has auxiliary contact pads which can be connected to an external printed circuit board. The primary production step in this case is cohesively connecting respective first contact areas of the first conductor tracks to at least one second contact area of a power semiconductor component and at least one third contact area of a load terminal element; afterwards, the assemblage composed of at least one power semiconductor component of a connection device and load terminal elements is arranged to form a housing of the power semiconductor module.

Method for producing a power semiconductor module, and power semiconductor module comprising a connection device

A power semiconductor module comprising: a substrate, a plurality of conductor tracks arranged thereon, the conductor tracks being electrically insulated from one another, and including power semiconductor components arranged thereon; a connecting device, composed of an alternating layer sequence of at least two electrically conductive layers and at least one electrically insulating layer disposed therebetween, for the circuit-conforming connection of the power semiconductor components, the conductor tracks and/or external contact devices. The electrically conductive layers form connecting tracks and at least one transformer is formed integrally with, and thus from the constituent parts of, the connecting device. The transformer is composed of at least one transmitter coil and at least one receiver coil, which are in each case arranged coaxially with respect to one another and are formed with spiral windings.

Power semiconductor module with control functionality and integrated transformer

A connecting device for the electrically conductive connection of electronic components and a substrate. The connecting device is formed as a film composite formed of at least one insulating film and at least two electrically conductive films disposed on opposite sides of the insulating film. The film composite is formed as a layer construction of a conductive film alternating with an insulating film, wherein at least one conductive film is structured and thus forms conductor tracks. Furthermore, at least one conductive film of a main area of the film composite is made of a first metal and has at least one film section having a layer of a second metal that is thinner in comparison with the thickness of the first layer.

Connecting device for electronic components

A circuit arrangement for a power semiconductor module provides low parasitic inductances and low loss. An electrically insulating substrate supports metallic ribbon connectors which in turn power attached semiconductor components. DC port conducts are positioned in close proximity to each other and are arranged in at least one partial sector parallel and in close proximity to the surface of the substrate and/or the ribbon connectors and electrically insulated from the same, and at least one AC port conductor is similarly attached. The port conductors include surface elements enabling simplified low-inductance wire bond connection from the port conductors to either the power semiconductor components or ribbon connectors or both.

Low-inductance circuit arrangement for power semiconductor modules

A power semiconductor module with a scalable construction, having a base plate or intended for direct mounting on a heat sink. The module has a framelike housing, a cover, terminal elements, extending to the outside of the housing for load contacts and auxiliary contacts. The module having at least two electrically insulating substrates disposed inside the housing, which in turn each comprise one insulating body and a plurality of metal conducting tracks, located on the first main face of the insulating body, which first main face is remote from the base plate or the heat sink. The metal connecting tracks are electrically insulated from one another, and power semiconductor components are located on and electrically connected to these connecting tracks. The substrates () are identical, and electrically connected to one another, and have the same type and number of power semiconductor components disposed thereon.

Semiconductor module with scalable construction

A power semiconductor module has a base plate comprising a framelike housing, a cap, and at least one electrically insulated substrate disposed inside the housing. The substrate comprises an insulation body with a plurality of metal connection tracks located thereon and insulated from one another, power semiconductor components located on the connection tracks, and terminal elements leading to the outside of the power semiconductor module for load and auxiliary contacts. Some of these terminal elements in the interior of the power semiconductor module comprise contact springs, which are disposed between the connection tracks and contact points on a printed circuit board. The printed circuit board has conductor tracks, which connect the contact points to contact elements that lead to the outside of the power semiconductor module.

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Erlangen, Germany

Thomas Stockmeier