Arch Specialty Chemicals, Inc.

Aoc, LLC

Thomas Steinhausler

Andrew J Blakeney

John Joseph Biafore

Patrick Foster

Sanjay Malik

Binod B De

Gregory Domenic Spaziano

Thomas J Folda

Sidney George Slater

Daniela White

Sydney George Slater

John E McAlvin

Paul Taylor Hutson

David J Zwissler

John J Young

Allen H Gabor

Daniel A Oakley

John Wilson

David Treadwell

Diana Klein

Kamana Kigweba

James S Tedesco

Thomas C Kendrick, Jr

Ulrich Schaedeli

Unsaturated polyester resin compositions with improved weathering characteristics are presented. Further, the manufacture of these unsaturated polyester resin compositions and their potential applications are presented.

Unsaturated polyester resin compositions with improved weatherability

Thermally cured undercoat for use in lithography of a thermally cured composition comprising a hydroxyl-containing polymer, an amino cross-linking agent and a thermal acid generator, wherein the hydroxyl containing polymer is a polymer comprising units m, n and o of the following formula:wherein Ris H or methyl; Ris a substituted or unsubstituted C-Caryl acrylate or C-Caryl methacrylate group wherein the substituted groups may be phenyl, Calkyl or Calkoxy; Ris a hydroxyl functionalized C-Calkyl acrylate, methacrylate or C-Caryl group, Ris a C-Clinear or branched alkylene; p is an integer of from 1 to 5 with the proviso that there are no more than thirty carbon atoms in the [&#x2014;RO&#x2014;]; Ris a C-Clinear, branched or cyclic alkyl, substituted or unsubstituted C-Caryl, or substituted or unsubstituted C-Calicyclic hydrocarbon; and m is about 40 to 70, n is about 15 to 35 and o is about 15 to 25.

Thermally cured underlayer for lithographic application

Molding compositions for sheet and bulk molded products having improved toughness comprise an unsaturated polyester, a monomer which is copolymerizable with the polyester, a thermoplastic polymer, a filler and a reinforcing agent.

Molding compositions having improved properties

A terpolymer with chemically amplified (acid labile) moieties and organosilicon moieties suitable for use as the binder resin for a photoimageable resist photoresist composition suitable for use in 193 nm photolithographic processes. The terpolymers have the following structural units: ##STR1## where R is a methyl or hydroxyethyl group, R.sup.1 is a hydrogen atom, a methyl group or a --CH.sub.2 COOCH.sub.3 group and R.sup.2 and R.sup.3 are each independently a hydrogen atom or a methyl group.

Radiation sensitive terpolymer, photoresist compositions thereof and 193

The present invention is directed to a thermally curable polymer composition comprising a hydroxyl-containing polymer and a polyfunctional isocyanate as a crosslinking agent, which is particularly useful in photolithographic coating of substrates. The thermally curable polymer composition may be dissolved in a solvent and used as an undercoat layer in deep UV lithography. Furthermore, the present invention further relates to a process for using the photolithographic coated substrate for the production of relief structures.

Hydroxy-diisocyanate thermally cured undercoat for 193 nm lithography

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Collierville, TN, United States of America

Thomas Steinhausler