Qorvo Us, Inc.

Rf Micro Devices, Inc.

Triquint Semiconductor Corporation

Thomas Scott Morris

Donald Joseph Leahy

Milind Shah

David Jandzinski

Stephen Craig Parker

Brian D Sawyer

Ulrik Riis Madsen

Robert C Hartmann

Howard Terry Glascock

Julio C Costa

Jon Chadwick

Charles E Carpenter

Brian Howard Calhoun

Kelly M Lear

John August Orlowski

Frank J Juskey

Jeffrey Dekosky

Jeffrey Miller

John Davisson

Rommel Quintero Nevarez

Jerry Holt

David Jon Hiner

David C Dening

Jonathan Hale Hammond

Jayanti Jaganatha Rao

Paul Stokes

Jon D Jorgenson

David Halchin

Joseph Edward Geniac

John Robert Siomkos

Dan Carey

Waite R Warren, Jr

Mark Alan Crandall

Rommel Quintero

Peter Cotterill

James Edwin Culler, Jr

Mudar Al-Joumayly

Mark Charles Held

Carl Hinshaw

Michael Meeder

Domingo Farias

Kyle Sullivan

Jose F Ordonez

Neftali Salazar

Lewis Kermit Law, Ii

W Kent Braxton

Chris Botzis

Stephen Parker

The disclosure relates to a shielded electronic module which includes a module shielding structure and an electronic module with an interposer, a shielded electronic submodule over the interposer, and a module mold compound over the interposer and encapsulating sides of the shielded electronic submodule. Herein, the shielded electronic submodule includes an electronic submodule and a submodule side shielding structure, which covers sides of the electronic submodule to provide the sides of the shielded electronic submodule. A top surface of the electronic module is a combination of a top surface of the module mold compound and a top surface of the shielded electronic submodule, which is not covered by the module mold compound. The module shielding structure directly and continuously covers the top surface and sides of the electronic module, such that the submodule side shielding structure is electrically connected to the module shielding structure to individually shield the electronic submodule.

Compartmentalized shielding of a module utilizing self-shielded sub-modules

The disclosure is directed to an electronic device with a solder interconnect and multiple material encapsulant. The electronic device includes a die last assembly with the die assembled to an electronic packaging substrate by a solder interconnect. At least a portion of a first dielectric material and the die are milled or ground, with a second dielectric material applied over an exposed portion of the die. A shield is then positioned over and electrically insulated from the die. Accordingly, such a configuration reduces a thickness or height of an electronic device with shielding and a die last assembly.

Electronic device with solder interconnect and multiple material encapsulant

Electronic substrates, contact pads for electronic substrates, and related methods are disclosed. Electronic substrates may include an electrically conductive layer that forms at least one contact pad and at least one metal trace on a non-conductive layer. The contact pads are arranged with greater thicknesses or heights above the non-conductive layer than the metal traces. Dielectric layers are disclosed that cover the metal traces while leaving top surfaces of the contact pads exposed. Top surfaces of the dielectric layers may be arranged to be coplanar with top surfaces of the contact pads to provide electronic substrates having generally planar top faces. Bottom faces of electronic substrates may include mounting pads that are coplanar with additional dielectric layers. Methods are disclosed that include forming dielectric layers to cover contact pads and metal traces, and removing surface portions of the dielectric layers until the contact pads are accessible through the dielectric layers.

Method of fabricating contact pads for electronic substrates

The present disclosure relates to a shielded electronic module, which includes a module substrate, an electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a second mold compound over a bottom surface of the module substrate, and a shielding structure. The second mold compound includes a recess extending inwardly from a bottom periphery of the second mold compound. The shielding structure completely covers a top surface of the module and extends over the side surface of the module until reaching the recess. Herein, the shielding structure is electrically grounded.

Shielded electronic modules and methods of forming the same utilizing plating and double-cut singulation

Electromagnetic shields for sub-modules of electronic modules are disclosed. Electronic modules may include multiple sub-modules arranged on a substrate with an electromagnetic shield arranged to conformally cover the sub-modules as well as portions of the substrate that are uncovered by the sub-modules. Electromagnetic shields are disclosed that are configured to extend between sub-modules to form one or more divider walls. The one or more divider walls may be configured to extend below mounting surfaces of electronic components in the sub-modules to provide improved reduction of electromagnetic interference (EMI) or crosstalk between various sub-modules. Electromagnetic shields are also disclosed that form perimeter sidewalls that extend below mounting surfaces of electronic components of sub-modules to provide improved reduction of EMI from other modules or other external sources.

Electromagnetic shields for sub-modules

The present disclosure relates to segmented shielding using wirebonds. In an exemplary aspect, a shield is formed from a series of wires (e.g., wirebonds) to create a wall and/or shielded compartment in an integrated circuit (IC) module. The wires can be located in any area within the IC module. The IC module may be overmolded with an insulating mold compound, and a top surface of the insulating mold can be ground or otherwise removed to expose ends of the wires to a shield layer which surrounds the insulating mold. Some examples may further laser ablate or otherwise form cavities around the ends of the wires to create stronger bonding between the wires of the shield and the shield layer.

Segmented shielding using wirebonds

A process for molding a back side wafer singulation guide is disclosed. Structures for heat mitigation include an overmold formed over a contact surface of a device layer of a wafer, covering bump structures. The overmold and bump structures are thinned and planarized, and the overmold provides an underfill to increase interconnect reliability of a semiconductor die in a flip chip bonded package. However, visibility of singulation guides on the contact surface is obstructed. A channel is formed extending through the device layer and into the handle layer, and is filled with the overmold. The handle layer is replaced with a thermally-conductive molding layer formed on the back side for dissipating heat generated by semiconductor devices. The thermally-conductive handle is thinned until the overmold in the channel beneath the device layer is exposed. The exposed overmold provides a visible back side singulation guide for singulating the wafer.

Process for molding a back side wafer singulation guide

Contact pads for electronic substrates and related methods

The present disclosure relates to a shielded double-sided module, which includes a module substrate with a ground plane, at least one top electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a number of first module contacts attached to a bottom surface of the module substrate, a second mold compound, and a shielding structure. The second mold compound resides over the bottom surface of the module substrate, and each first module contact is exposed through the second mold compound. The shielding structure completely covers a top surface and a side surface of the module, and is electrically coupled to the ground plane within the module substrate.

Double-sided module with electromagnetic shielding

A semiconductor die, which includes a first semiconductor device, a first passivation layer, and a first interconnect bump, is disclosed. The first passivation layer is over the first semiconductor device, which includes a first group of device fingers. The first interconnect bump is thermally and electrically connected to each of the first group of device fingers. Additionally, the first interconnect bump protrudes through a first opening in the first passivation layer.

Using an interconnect bump to traverse through a passivation layer of a semiconductor die

The present disclosure relates to a substrate structure with selective surface finishes used in flip chip assembly, and a process for making the same. The disclosed substrate structure includes a substrate body, a metal structure with a first finish area and a second finish area, a first surface finish, and a second surface finish. The metal structure is formed on a top surface of the substrate body, the first surface finish is formed over the first finish area of the metal structure, and the second surface finish is formed over the second finish area of the metal structure. The first surface finish is different from the second surface finish.

Substrate structure with selective surface finishes for flip chip assembly

The present disclosure provides electromagnetic shielding for integrated circuit modules with a module-bottom sealing procedure. First a precursor package with a number of integrated modules is provided. Each integrated module includes a module substrate having a number of module contacts at a bottom surface of the module substrate. A combination of a shielding protective material and a chemical resistant tape is then applied over the bottom surface of the module substrate, such that each module contact is sealed. Next, the precursor package is singulated at each inter-module area to form a number of individual integrated modules. A shielding structure is applied completely over a side surface of each individual integrated module. Herein, the shielding structure is electrically coupled to a ground plane within the module substrate.

Electromagnetic shielding for integrated circuit modules

Growing community of inventors

Lewisville, NC, United States of America

Thomas Scott Morris