Siemens Aktiengesellschaft

Thomas Schwinn

Bernd Roppelt

Jens Schmenger

Roman Kögler

Hubert Schierling

Lutz Namyslo

Reinhold Dillig

Roland Lorz

Bernd Herrmann

Lucia Hirsch

Jürgen Kimpel

Roman KÖGLER

A heat sink assembly for semiconductor components includes a first and second heat sinks, each having a component and cooling fin side, which is provided with cooling fins arranged one behind another such that a cooling medium initially flows in a flow direction through cooling channels formed by the cooling fins of the first heat sink and subsequently flows through cooling channels formed by the cooling fins of the second heat sink, wherein a first inlet cross-section which, on an inlet side of the first heat sink, composed of individual cross-sections of the associated cooling channels of the first heat sink, is reduced via a partition partially covering the cooling channels on the inlet side of the first heat sink, and a second inlet cross-section which, on an inlet side of the second heat sink, is composed of individual cross-sections of the associated cooling channels of the second heat sink.

Heat sink assembly and power converter assembly

In a method for cooling a semiconductor, a time profile of a load of the semiconductor is determined over a predefinable period of time. A cooling apparatus for cooling the semiconductor is controlled or regulated depending on a load cycle of the semiconductor resulting from the determined time profile of the load, and the cooling apparatus is controlled or regulated as a function of the load averaged over the predefinable period of time.

Cooling of semiconductors for optimised service life

A power module includes a heat sink, a power unit formed at least partially inside the heat sink and/or on the heat sink and comprising a semiconductor element and a substrate, and a device designed to enclose the power unit and to center a control unit with respect to the power unit. The device includes a frame designed to surround the substrate at least partially, a first projecting section designed to engage in a recess or an opening of the heat sink, and a second projecting section designed to engage in a recess or an opening or a notch of the control unit and to have an outline which when viewed in cross-section is at least essentially star-shaped with at least a first leg, a second leg and a third leg.

Power module

A wiring of a semiconductor switch having a gate, a collector or a drain, and an emitter or a source, includes a first arrangement having a first capacitor connected in series with a parallel connection having a first resistor and a first diode. The first arrangement is connected between the gate and the collector or drain, wherein the first diode is connected away from the gate in a flow direction. A second arrangement is connected in parallel with the first arrangement and includes a second capacitor connected in series with a parallel connection having a second resistor and a second diode, wherein the second diode lies toward the gate in the flow direction.

Wiring of a semiconductor switch

A frequency converter has an AC-DC converter and an inverter interconnected via a DC link having a first and a second circuit branch interconnected by a DC link capacitor and a commutation capacitor. To protect the AC-DC converter from damage caused by an overcurrent, the first circuit branch includes a choke in which a capacitor-side terminal is connected to a terminal of the DC link capacitor and a switch-side terminal is connected via a semiconductor switch to a DC link terminal of the AC-DC converter and also via a freewheeling diode to the second circuit branch. The semiconductor switch is configured to control a magnitude of an electric current flowing from the AC-DC converter into the DC link capacitor in accordance with a control signal.

Growing community of inventors

Herzogenaurach, Germany

Thomas Schwinn